Described are adhesive compositions containing a block copolymer component that includes a midblock segment and a plurality of end block segments, each end block segment comprising polystyrene, a (meth)acrylic functional additive having a glass transition temperature of from 50° C. to 160° C., a first tackifier compatible with the midblock segment and containing a hydrocarbon, and a second tackifier compatible with the end block segments and containing a polyphenylene ether. These compositions are useful in providing pressure-sensitive adhesives that are melt processible, display a high temperature resistance, and effectively bond to low surface energy substrates.

Described are adhesive compositions containing a block copolymer component that includes a midblock segment and a plurality of end block segments, each end block segment comprising polystyrene, a (meth)acrylic functional additive having a glass transition temperature of from 50° C. to 160° C., a first tackifier compatible with the midblock segment and containing a hydrocarbon, and a second tackifier compatible with the end block segments and containing a polyphenylene ether. These compositions are useful in providing pressure-sensitive adhesives that are melt processible, display a high temperature resistance, and effectively bond to low surface energy substrates.

A rubber resin material with high thermal conductivity and low dielectric properties and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition and at least one surface-modified inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one surface-modified inorganic filler has one or more modifying functional groups that are selected from the group consisting of an acrylic group, a functional group having a nitrogen-containing main or branched chain, a double bond-containing functional group, and an epoxy group.

A composition for injection molding includes specific amounts of a poly(phenylene ether), a first hydrogenated triblock copolymer, a second hydrogenated triblock copolymer, a polypropylene, a polybutene, an ethylene/1-octene copolymer, and a flame retardant. At least one of the first and second hydrogenated triblock copolymers has a pre-hydrogenation vinyl content of 50 to 100 mole percent, based on moles of incorporated polybutadiene. Injection molded articles prepared from the composition include cable connectors and their parts.

A copolymer having the structure (I) wherein Q.sup.1, Q.sup.2, Q.sup.3, Q.sup.4, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin. ##STR00001##

A copolymer having the structure (I) wherein Q.sup.1, Q.sup.2, Q.sup.3, Q.sup.4, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin. ##STR00001##

A silane-modified polyphenylene ether resin and a preparation method thereof are provided. A polyphenylene ether resin having hydroxyl groups at both ends is reacted with a silane having at least one alkoxy group and at least one vinyl group at the end, so as to obtain the silane-modified polyphenylene ether resin with a vinyl group at the end.

The present invention relates to a resin composition including a binder resin and an organic-inorganic composite filler, a prepreg including the same, a laminated plate including the same, and a resin-coated metal foil including the same.

The present invention relates to a resin composition including a binder resin and an organic-inorganic composite filler, a prepreg including the same, a laminated plate including the same, and a resin-coated metal foil including the same.

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4.

##STR00001##