Patent classifications
C08L71/123
Resin composition and shaped product
Provided are a resin composition and a shaped product having excellent smoke generation properties and chemical resistance. The resin composition and the shaped product contain: a polyphenylene ether resin (I); a polypropylene resin (II); a hydrogenated block copolymer (III) that is a hydrogenated product of a block copolymer including a polymer block A and a polymer block B in which the total amount of vinyl bonding is 30-90%; and a phosphate ester compound (IV). Relative to 100 parts by mass, in total, of components (I) and (II), component (I) is 40-99 parts by mass, component (II) is 1-60 parts by mass, component (III) is 1-20 parts by mass, and component (IV) is 5-45 parts by mass. A partition ratio of component (IV) present in a fraction that dissolves in chloroform and component (IV) present in a fraction that dissolves in o-dichlorobenzene is 10 or more.
Resin composition and shaped product
Provided are a resin composition and a shaped product having excellent smoke generation properties and chemical resistance. The resin composition and the shaped product contain: a polyphenylene ether resin (I); a polypropylene resin (II); a hydrogenated block copolymer (III) that is a hydrogenated product of a block copolymer including a polymer block A and a polymer block B in which the total amount of vinyl bonding is 30-90%; and a phosphate ester compound (IV). Relative to 100 parts by mass, in total, of components (I) and (II), component (I) is 40-99 parts by mass, component (II) is 1-60 parts by mass, component (III) is 1-20 parts by mass, and component (IV) is 5-45 parts by mass. A partition ratio of component (IV) present in a fraction that dissolves in chloroform and component (IV) present in a fraction that dissolves in o-dichlorobenzene is 10 or more.
Method of forming high molecular weight poly(phenylene ether), poly(phenylene ether) formed thereby, and fiber and article comprising the poly(phenylene ether)
A poly(phenylene ether) can be prepared by a method that includes reacting 2,6-dimethylphenol in the presence of toluene, oxygen, copper ion, bromide ion, and N,N-di-tert-butylethylenediamine to form a poly(phenylene ether). The mole ratio of 2,6-dimethylphenol to copper ion is 160:1 to 300:1, the mole ratio of N,N-di-tert-butylethylenediamine to copper ion is 1.5:1 to 3:1, and the mole ratio of atomic oxygen to 2,6-dimethylphenol is 0.9:1 to 1.5:1. The process can produce poly(phenylene ether) having a high molecular weight and a high incorporated amine content.
PHENYLENE ETHER COPOLYMER AND COMPOSITIONS COMPRISING SAME
A copolymer having the structure (I) wherein Q.sup.1, Q.sup.2, Q.sup.3, Q.sup.4, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin.
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PHENYLENE ETHER COPOLYMER AND COMPOSITIONS COMPRISING SAME
A copolymer having the structure (I) wherein Q.sup.1, Q.sup.2, Q.sup.3, Q.sup.4, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin.
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POLYMERS AND PROCESS FOR THEIR MANUFACTURE
There is disclosed polymers, a process for manufacturing polymers and uses of the polymers. The polymers are polyaryl ether ketones and the process includes a nucleophilic polycondensation of a bisphenol with an organic dihalide compound in a reaction mixture comprising sodium carbonate and potassium carbonate, in an aromatic sulfone solvent, at a reaction temperature rising to a temperature from 290 C. to 320 C. immediately prior to the addition of a salt to the reaction mixture, wherein the molar ratio of the salt to potassium carbonate is from 6.0 to 10.0. Further organic dihalide compound is added to the reaction mixture wherein the molar ratio of further organic dihalide compound to bisphenol is from 0.009 to 0.035. The resulting reaction mixture is maintained at a temperature at from 290 C. to 320 C. for from 20 to 180 minutes and then the resulting reaction mixture is cooled and the PAEK recovered.
Metal-clad laminate, printed circuit board, and method of manufacturing same
A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 m.
Electrically Conductive Microwave Shielding Compositions
A thermoplastic composition includes: (a) from about 82 wt % to about 92 wt % of a thermoplastic resin including poly(phenylene ether) and polystyrene; and (b) from about 3 wt % to about 13 wt % of a carbon-based filler. The carbon-based filler has a specific surface area of at least 650 square meters per gram (m2/g) and an Oil Absorption Number of at least 250 milliliter per 100 gram (ml/100 g). The composition has a dielectric constant of between 3.5 and 10 and a dissipation loss of between 0.25 and 5, as measured at a frequency of between about 75 gigahertz (GHz) and about 110 GHz. A -inch-thick molded sample of the composition exhibits a Percent Absorbed Power measured in Transmission mode of at least 50% when observed according to a Free Space method at frequencies from about 75 GHz to about 110 GHz.
Electrically Conductive Microwave Shielding Compositions
A thermoplastic composition includes: (a) from about 82 wt % to about 92 wt % of a thermoplastic resin including poly(phenylene ether) and polystyrene; and (b) from about 3 wt % to about 13 wt % of a carbon-based filler. The carbon-based filler has a specific surface area of at least 650 square meters per gram (m2/g) and an Oil Absorption Number of at least 250 milliliter per 100 gram (ml/100 g). The composition has a dielectric constant of between 3.5 and 10 and a dissipation loss of between 0.25 and 5, as measured at a frequency of between about 75 gigahertz (GHz) and about 110 GHz. A -inch-thick molded sample of the composition exhibits a Percent Absorbed Power measured in Transmission mode of at least 50% when observed according to a Free Space method at frequencies from about 75 GHz to about 110 GHz.
RESIN MOLDED BODY, BATTERY PACK
A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50 C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m.Math.K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.