Patent classifications
C08L71/123
POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE
A composition includes specific amounts of a poly(phenylene ether), a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, an organophosphate ester, and compound that improves adhesion to potting silicone sealant. The adhesion promoter can be a phenolic compound, a hydroxysilyl-terminated polydiorganosiloxane, or a combination thereof. The composition is particularly useful for molding parts of photovoltaic junction boxes that utilize potting silicone sealant as an internal electric al insulator.
Flame-retardant polystyene composition
The invention relates to a polystyrene composition comprising a polystyrene and compound according to formula (III).
POLY(PHENYLENE ETHER) COMPOSITION, METHOD OF FORMING SAME, AND ARTICLES PREPARED THEREFROM
A composition includes specific amounts of a poly(phenylene ether), a rubber-modified polystyrene, a flame retardant containing an organophosphate ester, and a mold release agent containing a high viscosity polydiorganosiloxane. The composition excludes polyolefin waxes. The high viscosity polydiorganosiloxane can be provided in the form of a room temperature solid masterbatch, thereby facilitating compounding of the composition. The composition is useful for injection molding, and particularly useful for injection molding battery holders for cell phone tower back-up power systems.
FUNCTIONALIZED GRAPHENE SHEETS HAVING HIGH CARBON TO OXYGEN RATIOS
Functionalized graphene sheets having a carbon to oxygen molar ratio of at least about 23:1, an apparatus for preparing the same, and method of preparing the same using the apparatus.
Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4. ##STR00001##
Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4. ##STR00001##
Polyamide molding compound with low dielectric loss factor
The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C;
wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.
POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE
A desirable balance of heat resistance and flame retardancy is exhibited by a composition that includes specific amounts of a poly(phenylene ether), a poly(phenylene ether)-polysiloxane block copolymer reaction product, a hydrogenated block copolymer of an alkenyl aromatic compound and a conjugated diene, and an organophosphate flame retardant. The composition minimizes or excludes reinforcing fillers, certain adhesion promoters, and addition polymers that include repeat units derived from a glycidyl ester of an ?,?-ethylenically unsaturated acid.
FLAME-RETARDANT POLYSTYENE COMPOSITION
The invention relates to a polystyrene composition comprising a polystyrene and compound according to formula (III).
##STR00001##
LAMINATED MOLDED ARTICLE
A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous -olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).
##STR00001##