Functionalized graphene sheets having a carbon to oxygen molar ratio of at least about 23:1 and method of preparing the same.

Disclosed is a flame-retardant polyphenylene ether resin composition having high rigidity and high impact strength. More particularly, disclosed is a flame-retardant polyphenylene ether resin composition having high rigidity and high impact strength which enhances environmental stress cracking resistance and impact resistance, compared to general materials, while exhibiting superior mechanical strength such as flame retardancy, tensile strength, flexural strength, flexural modulus, etc. through addition of particularly glass fiber, maleic anhydride-grafted polyphenylene ether, a thermoplastic styrenic elastomer, an ethylene terpolymer and an epoxy resin to a polyphenylene ether resin, and thus, may be used as a material of automobile battery cell modules or electric/electronic components.

A composition is prepared by melt blending specific amounts of components including a poly(phenylene ether), a first hydrogenated block copolymer (HBC1) that includes a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content of 50 to 75 weight percent, and a second hydrogenated block copolymer. The second hydrogenated block copolymer can selected from five different hydrogenated block copolymer types and their combinations. The composition exhibits high light transmittance, low haze, and high impact strength at low temperature, which make it useful for molding objects such as containers for storage in refrigerators and freezers.

Functionalized graphene sheets having a carbon to oxygen molar ratio of at least about 23:1 and method of preparing the same.

Carbon phosphonitride (CPN) including tricyanophosphine (P(CN).sub.3), its pre-polymer (CPN-PP), and/or solid CPN(C.sub.3N.sub.3P) can serve as a useful additive for thermoset resins, resulting in improved thermal and mechanical properties.

This present disclosure provides resin composition and article made therefrom, including prepreg, resin film, laminate, or printed circuit board. Resin composition comprises: (A) 100 parts by weight of unsaturated CC double bond-containing polyphenylene ether resin; and (B) 20 parts by weight to 100 parts by weight of phosphorus-containing polyolefine resin. Phosphorus-containing polyolefine resin consists of (a) structural unit and (b) structural unit, and/or consists of (a) structural unit, (b) structural unit and (c) structural unit, wherein (a) structural unit comprises any one of (al) structural unit, (a2) structural unit, or combination thereof, and (b) structural unit comprises any one of (bi) structural unit, (b2) structural unit, or combination thereof. Article has improvement in at least one of following properties: stickiness resistance, glass transition temperature, copper foil peeling strength, dielectric properties, water absorption rate, flame retardancy, thermal resistance after moisture absorption, appearance of laminate, alkali resistance.

##STR00001##

A resin composition is disclosed, comprising: (A) 100 parts by weight of an unsaturated carbon-carbon double bond-containing polyphenylene ether resin and (B) 20-70 parts by weight of a compound represented by Formula (1), wherein in Formula (1), X is adamantyl group, each of R.sub.1-R.sub.8 is independently hydrogen atom or C1-C3 alkyl group, at least one of R.sub.1-R.sub.8 is C1-C3 alkyl group, and n is an integer of 1-7. In addition, an article made from the above resin composition is also disclosed. The article comprises a prepreg, a resin film, a laminate or a printed circuit board, and has improvements in one or more of the following properties: glass transition temperature, T300 thermal resistance, percent thermal expansion at Z-axis, dissipation factor, dissipation factor variation rate under moisture and heat, dissipation factor variation rate under heat, water absorption rate and thermal resistance after moisture absorption.

##STR00001##

An object is to provide a polyether nitrile molding material that exhibits high flowability during melt molding. As a solution, provided is a polyether nitrile molding material obtained by molding a polyether nitrile that has a melt flow rate (MFR) of 1 g/10 min or more as measured at 390 C. under a load of 5000 g in accordance with ISO 1133 after being heated in air at 400 C. for 10 minutes.

A low dielectric high Tg resin composition includes a resin system, a halogen-free flame retardant, a coupling agent, and an inorganic filler. The resin system includes a low dielectric resin, a crosslinking agent, and a polyindene resin which are each added in a specific weight percentage. The low dielectric resin is formed from a monomer composition including styrene, divinylbenzene, and ethylene. Therefore, the low dielectric high Tg resin composition has a glass transition temperature not less than 200 C., and the low dielectric high Tg resin composition after being cured has a dielectric constant (Dk) between 3.0 and 3.2 and a dielectric loss factor (Df) less than 0.0013 at 10 GHz. Based on the above, a prepreg and a metal clad laminate applying the low dielectric high Tg resin composition are further provided.

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.