Provided are a random copolymer for forming a neutral layer promoting directed self-assembly pattern formation, a laminate for forming a pattern including the same, and a method for forming a high-quality pattern using the same.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

A coating composition includes: (a) a first acrylic polymer formed from a reaction mixture including: (i) an ethylenically unsaturated monomer including an acid group or an amine group; (ii) a reactive solvent reactive with the ethylenically unsaturated monomer (i); and (iii) a second monomer reactive with ethylenically unsaturated monomer (i); and (b) a second acrylic polymer different from the first acrylic polymer, where the second acrylic polymer (b) has a Mw of at least 100,000 Da. A method of preparing such a coating composition and coatings and coated substrates formed therefrom are also disclosed. Coatings formed from the disclosed coating composition may exhibit improved stain resistance.

A protective film-forming composition which protects against a semiconductor wet etching solution, contains a solvent and a compound or polymer thereof containing at least one acetal structure in a molecule thereof, and forms a protective film exhibiting excellent resistance against a semiconductor wet etching solution during the lithographic process when producing semiconductors; a method for producing a resist pattern-equipped substrate which uses the protective film; and a method for producing a semiconductor device.

The present application provides a non-slip board, relating to a technical field of non-slip materials, and aims at solving the problem that after long-term use, the flooring and the sound insulating pad have problems such as deformation, corner warping and the like due to expansion and contraction, which also causes displacement on the base surface. The present application further provides a production process of the non-slip board, in which the non-slip coating layer is applied to a sound insulating pad, a soft resilient floor board, a coiled material, a homogeneous coiled material or a hard floor board, and the sound insulating pad, the coiled material or the hard floor board is not prone to displacement after being laid onto the foundation ground.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

A window module including a window, a first print layer, an ink layer, and a protective layer covering the ink layer. The ink layer includes a polymer resin polymerized from monomers including a first monomer which is an acrylic monomer substituted with a hydroxy group, a second monomer having an epoxy group, and at least one of a third monomer having a substituted or unsubstituted phenyl group or a fourth monomer which is an acrylic monomer having a substituted or unsubstituted bicyclic alkyl group, and thus, has excellent durability, chemical resistance, and abrasion resistance.

The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25 C. of 3 MPa or less and an elastic modulus at 25 C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm.sup.2 or more.