The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25 C. of 3 MPa or less and an elastic modulus at 25 C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm.sup.2 or more.

A curable film-forming composition is provided, comprising: (a) a polymeric binder comprising epoxy functional groups; (b) a curing agent comprising acid functional groups that are reactive with the epoxy functional groups of (a); (c) a non-aqueous dispersion comprising a dispersion polymerization reaction product of a reaction mixture comprising an ethylenically unsaturated monomer and a nonlinear, random, acrylic polymer stabilizer; and (d) fumed silica. The dispersion polymerization reaction product in the non-aqueous dispersion (c) is present in the curable film-forming composition in an amount of 0.5 to 10 percent by weight, and the fumed silica (d) is present in an amount of 0.5 to 5 percent by weight, based on the total weight of resin solids in the curable film-forming composition. Also provided are multi-layer coated articles that include the curable film-forming compositions described above.

A curable film-forming composition is provided, comprising: (a) a polymeric binder comprising epoxy functional groups; (b) a curing agent comprising acid functional groups that are reactive with the epoxy functional groups of (a); (c) a non-aqueous dispersion comprising a dispersion polymerization reaction product of a reaction mixture comprising an ethylenically unsaturated monomer and a nonlinear, random, acrylic polymer stabilizer; and (d) fumed silica. The dispersion polymerization reaction product in the non-aqueous dispersion (c) is present in the curable film-forming composition in an amount of 0.5 to 10 percent by weight, and the fumed silica (d) is present in an amount of 0.5 to 5 percent by weight, based on the total weight of resin solids in the curable film-forming composition. Also provided are multi-layer coated articles that include the curable film-forming compositions described above.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.

According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.

A dirt repellant panel coated with a powder coating composition that includes a polymeric binder and an anionic fluorosurfactant present in an amount ranging from about 0.1 wt. % to about 4 wt. %.

Food and beverage containers and methods of coating are provided. The food and beverage containers include a metal substrate that is at least partially coated with a coating composition that includes a water-dispersible resin system and an aqueous carrier. The resin system includes an epoxy component and an acrylic component. In a preferred embodiment, the coating composition is at least minimally retortable when cured.

There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.0% by mass with respect to the content of all components of the resin composition, except the solvent: (A) component: a self-crosslinking copolymer having a structural unit of Formula (1) below and a structural unit of Formula (2) below (B) component: a compound of Formula (3) below ##STR00001##
wherein R.sup.0 is each independently a hydrogen atom or a methyl group, X is O or NH, R.sup.1 is a single bond or an alkylene group, R.sup.2 is an alkyl group, a is an integer of 1 to 5, b is an integer of 0 to 4, R.sup.3 is a divalent organic group having an ether bond and/or an ester bond, R.sup.5 is an alkyl group, f is an integer of 1 to 5, g is an integer of 0 to 4, R.sup.6 is a single bond or an alkylene group, Y is a single bond or an ester bond, A is a mono- to tetra-valent organic group which optionally contain at least one hetero atom, or a hetero atom, and h is an integer of 1 to 4.