A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

At least some aspects of the present disclosure feature a bonding layer including a support layer and discrete adhesive patches disposed on one or both sides of the support layer. At least some aspects of the present disclosure feature a flexible display using a bonding layer including discrete adhesive patches.

The invention relates to a polypropylene composition comprising a propylene homopolymer or propylene-ethylene copolymer having an ethylene content of at most 1.0 wt % based on the propylene-ethylene copolymer, wherein the amount of propylene homopolymer or propylene-ethylene copolymer is at least 98 wt %, for example at least 98.5 wt %, preferably at least 99 wt %, more preferably at least 99.5, for example at least 99.75 wt % based on the polypropylene composition, wherein the polypropylene composition has a melt flow rate in the range of 0.70 to 2.4 dg/min as measured according to IS01 133 (2.16 kg/230 C.), an Mw/Mn in the range from 7.0 to 13.0, wherein Mw stands for the weight average molecular weight and Mn stands for the number average weight, an Mz/Mn is in the range from 20 to 50, wherein Mz stands for the z-average molecular weight and wherein Mw, Mn and Mz are measured according to ASTM D6474-12.

Disclosed is laminate for a non-aqueous secondary battery which may be prevented from undergoing blocking. The laminate comprises a non-porous substrate layer, and an adhesive layer formed on a surface on one side of the substrate layer, wherein a surface roughness of the surface on the one side of the substrate layer is greater than a surface roughness of a surface on the other side of the substrate layer. Preferably, the surface roughness of the surface on the one side of the substrate layer is 0.20 m or more and 2.00 m or less. Preferably, the surface roughness of the surface on the other side of the substrate layer is 0.01 m or more and 0.15 m or less.

It is an object of the present invention to provide an adhesive sheet for skin patch, having adhesive force and cohesive force that are practicable as a pharmaceutical product and exhibiting high drug solubility and sufficient drug skin permeability. According to the present invention, provided is an adhesive sheet for skin patch, having an adhesive layer on a support, wherein the adhesive layer comprises, at least, a thermoplastic elastomer and a long-chain branched alcohol having a total carbon number of 13 or more, the long-chain branched alcohol is comprised in an amount of 40 parts by weight or more and 200 parts by weight or less, with respect to 100 parts by weight of the thermoplastic elastomer, and the adhesive layer does not comprise a tackifier, or comprises a tackifier in an amount of 30% by weight or less, with respect to the amount of the entire adhesive layer.