Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m.sup.2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.

An adhesive label includes a polymeric first film layer that is nonoriented and has a significant inherent shrinkage when heated above ambient temperature. The label is useful in various labeling applications and especially adhesive labeling of reusable and recyclable containers which require removal of the label during a washing process in a warm or hot washing fluid.

To provide a support for manufacturing semiconductor packages which has excellent durability in treatments such as polishing, heating, exposing/developing, plating, and vacuuming; a use of the support for manufacturing semiconductor packages; and a method of manufacturing semiconductor packages. The support includes a substrate layer and an adhesive layer adjacent to the substrate layer, wherein the substrate layer is formed of an alicyclic structure-containing resin film.

The present invention relates to a peel detection label that is a laminate including a backing, a pattern layer formed in a part of the surface of the backing, and a pressure sensitive adhesive laminate having at least a pressure sensitive adhesive layer (X) and a substrate layer (Y) laminated in this order thereon, and satisfying the following requirement (1), wherein an elastic modulus of the substrate layer (Y) is 10 MPa or more and 800 MPa or less:

Requirement (1): On attaching the peel detection label onto an adherend and then peeling it from the adherend, interfacial peeling occurs between the backing and the pattern layer, whereby the presence or absence of peeling of the peel detection label from the adherend becomes visually detectable.

Certain embodiments described herein are directed to security bin mats and security bins that include one more bioactive materials. In some embodiments, the security bin mats can be used with security bins in screening applications such as those used in airports, courthouses and other facilities. The security bin mats and security bins can be used to reduce spread of infections.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

A heating tape comprises an insulated heating element that includes a heating element layer comprising a polymer composite having conductive particles and at least one set of conductive electrodes at least partially embedded in the polymer composite and extending along at least a substantial portion of the length of the heating tape. A heating tape system for a pipe or other surface, further includes a power ramp controller having a solid state relay component to regulate an in-rush of current to the heating element. The heating tape system also includes a connector having multiple contact points.