Provided is a PSA sheet that allows installation of a protection sheet with good shape precision on the surface of an object to be protected. The PSA sheet provided by this invention comprises a substrate whose primary component is a resin film and a PSA layer placed on one face of the substrate. The PSA sheet comprises a protection sheet part which is adhered to an adherend to protect it, a marginal part bounded from the protection sheet part by a tear-off line surrounding the protection sheet part, and a tear-aiding structure provided along the tear-off line. The PSA sheet is configured so that after the protection sheet part is adhered to the adherend, when the marginal part is pulled in a direction in which the PSA sheet is peeled off the adherend, the marginal part is torn off the protection sheet part.

An adhesive containing silicone, in the form of an adhesive compound which contains at least a first adhesive component and a second adhesive component containing silicone is provided. The second, silicon-laced adhesive component consists of a non-crosslinked polysiloxane. The kinematic viscosity of the non-crosslinked polysiloxane is at least 100,000 mm.sup.2/s and at most 10,000,000 mm.sup.2/s or that the molar mass of the non-crosslinked polysiloxane is less than 10,000 g/mol, and the second, silicone-containing adhesive component is microencapsulated. Alternatively it can be provided that the molar mass of the polysiloxane is at least 80,000 g/mol and at most 500,000 g/mol, or that the kinematic viscosity of the non-crosslinked polysiloxane is less than 100,000 mm.sup.2/s, and the second, silicone-containing adhesive component is microencapsulated.

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and at least one electronic component affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in an electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand with the adhesive film interposed between the electronic component and the electronic component installation region, the electronic component testing apparatus being provided with a probe card at a position facing the sample stand and includes a probe terminal; a step (C) of evaluating the properties of the electronic component while being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a subsequent step (D) of picking up the electronic component from the adhesive film.

An identification sheet (X1) according to the present invention includes a backing sheet (10) and a pressure-sensitive adhesive sheet (20). The backing sheet (10) bears a distinguishing mark (M1). The pressure-sensitive adhesive sheet (20) has a multilayer structure including a substrate layer (21) and a pressure-sensitive adhesive layer (22). The pressure-sensitive adhesive layer (22) is removably attachable to the backing sheet (10). The pressure-sensitive adhesive sheet (20) bears a distinguishing mark (M2). The identification sheet (X1) as above is suitable for keeping on surely providing the admissibility of evidence of a collected target material to be identified.

Disclosed is a film-wrapped type hot melt adhesive, comprising: a film made from a thermoplastic resin composition and a hot melt adhesive wrapped by the film, wherein the thermoplastic resin composition comprises an ethylene homopolymer, and a concavo-convex is formed on a surface of the film. The film-wrapped type hot melt adhesive has blocking resistance and thermal stability which are improved in a balanced manner.

A label comprising a body having a first side for attaching to a container and a second side for displaying information, the first side includes a releasable adhesive for attaching the label to a container, wherein the releasable adhesive is treatable to cause the label to be separated from the container, and at least a part of the body is heat sensitive such that the label curls towards the first side to conceal part of the releasable adhesive when the label is heated to hinder the label separated from the container from re-attaching to the container.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

An adhesive composition, an adhesive, and an adhesive sheet capable of exhibiting good adhesion performance even on a low-polarity adherend are provided. The adhesive composition according to the present disclosure includes a (meth) acrylic polymer with a solubility parameter of 10.0 (cal/cm.sup.3).sup.0.5 or more according to the Fedors method and a modified polyolefin.

A pressure sensitive adhesive composition and a protective film employing the same are provided. The pressure sensitive adhesive composition includes 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer includes at least one block copolymer. The block copolymer includes a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets one of the following conditions: (1) the content of the vinyl aromatic monomer is from 15 wt % to 25 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt % or, (2) the content of the vinyl aromatic monomer is from 10 wt % to 15 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt %, or greater than or equal to 60 wt %.

Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.