The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

The present invention relates to polymer latex composition for fibre binding comprising: a) 50 to 98 wt.-% based on the total weight of latex particles in the composition of first latex particles having a volume average particle size of 80 to 1000 nm, wherein the first latex particles optionally bear functional groups and if functional groups are present they are selected from functional groups consisting of acid functional groups and salts, amides or anhydrides thereof, silane functional groups, and combinations thereof; b) 2 to 50 wt.-% based on the total weight of latex particles in the composition of second latex particles having a volume average particle size of 5 to 70 nm bearing epoxy functional groups, to the use of that composition for fibre binding, to a fibre structure comprising the dried residue of that composition and to a method for increasing the strength of a fibre structure.

The present invention relates to polymer latex composition for fibre binding comprising: a) 50 to 98 wt.-% based on the total weight of latex particles in the composition of first latex particles having a volume average particle size of 80 to 1000 nm, wherein the first latex particles optionally bear functional groups and if functional groups are present they are selected from functional groups consisting of acid functional groups and salts, amides or anhydrides thereof, silane functional groups, and combinations thereof; b) 2 to 50 wt.-% based on the total weight of latex particles in the composition of second latex particles having a volume average particle size of 5 to 70 nm bearing epoxy functional groups, to the use of that composition for fibre binding, to a fibre structure comprising the dried residue of that composition and to a method for increasing the strength of a fibre structure.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

The invention relates to a thermally curable adhesive film comprising at least one layer of an adhesive comprising at least one epoxy-functionalized (co)polymer (A) having a weight-average molar mass in the range from 5000 g/mol to 5 000 000 g/mol and/or at least one epoxy-containing compound (B) different from the (co)polymer (A); at least one free-radical former (C); and at least one photoacid former (D). The invention further relates to a bond comprising two substrates that are bonded by the adhesive film or the adhesive of the present invention, and to a method of joining two substrates using the adhesive film or the adhesive of the present invention.

The present invention provides a UV curable adhesive, wherein based on a total weight of the UV curable adhesive, the UV curable adhesive comprises: from 30 to 70 wt % of an acrylate oligomer; from 20 to 65 wt % of an acrylate monomer; from 1 to 10 wt % of acryloyl morpholine; from 1 to 15 wt % of a photo initiator; and from 0 to 10 wt % of a thickening agent, wherein the acrylate oligomer has a weight average molecular weight in a range of from 10,000 to 100,000 grams/mole and a glass transition temperature in a range of from −50 to 0° C. According to the technical solution of the present invention, the adhesive layer obtained from curing the UV curable adhesive is relatively thick (for example, 0.8 mm), and the adhesive layer has good adhesion property, cohesive force, and tackiness.

Provided are a curable composition including, a block copolymer including a block A which has a constitutional unit having an ethylenically unsaturated group in a side chain of a polymer compound, a pigment, and, a photopolymerization initiator, in which a content of a polymerizable compound is 15 mass % or less with respect to a total solid content of the curable composition; a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element or an image display device including the color filter.

Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.