A unit cell includes a separator and an electrode, which are alternately laminated by a predetermined number. The unit cell is configured such that: the unit cell is laminated in the order of a lower separator, any one electrode of an anode or a cathode, an upper separator, and the other one electrode of the anode or the cathode, wherein at least one surface of the electrode and the separator is applied with an adhesive to adhere the electrode and the separator or the lower separator and the upper separator. The adhesive contains an adhesive composition comprising a copolymer and a rosin ester-based additive, the copolymer contains 60.1 to 79.9% by weight of two or more kinds of alkyl (meth)acrylate-based repeating units (A), and 20.1 to 39.9% by weight of (meth)acrylate-based repeating unit (B) having a hydroxyl group at its end.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

The present invention refers to a method for producing polymeric compositions, preferably in the form of water-based (i.e. waterborne) compositions, more preferably dispersions (i.e. emulsions or latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives, particularly pressure-sensitive adhesives degradable under basic conditions, as well as to the polymeric compositions thus produced and to their applications.

The present invention refers to a method for producing polymeric compositions, preferably in the form of water-based (i.e. waterborne) compositions, more preferably dispersions (i.e. emulsions or latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives, particularly pressure-sensitive adhesives degradable under basic conditions, as well as to the polymeric compositions thus produced and to their applications.

One embodiment of the present invention relates to an adhesive composition for a decorative film, a decorative film, or a decorative molded body. The adhesive composition for a decorative film contains a (meth)acrylic polymer (A) that satisfies (I) and (II) below, has a weight-average molecular weight of 300,000 or less as measured by gel permeation chromatography, and has a glass transition temperature of higher than 0° C. and lower than 50° C. as determined from a peak temperature of tan δ measured by dynamic mechanical analysis. Relative to a total of 100 mass % of the (meth)acrylic polymer (A) and a (meth)acrylic polymer (Ah) having a glass transition temperature of 50° C. or higher, a percentage content of the (meth)acrylic polymer (Ah) is less than 25 mass %. (I) The (meth)acrylic polymer (A) is a polymer of a monomer component that contains 19 mass % or more of a monomer (a1) that does not have a crosslinkable functional group. (II) A homopolymer of the monomer (a1) has a glass transition temperature of 0° C. or higher.

One embodiment of the present invention relates to an adhesive composition for a decorative film, a decorative film, or a decorative molded body. The adhesive composition for a decorative film contains a (meth)acrylic polymer (A) that satisfies (I) and (II) below, has a weight-average molecular weight of 300,000 or less as measured by gel permeation chromatography, and has a glass transition temperature of higher than 0° C. and lower than 50° C. as determined from a peak temperature of tan δ measured by dynamic mechanical analysis. Relative to a total of 100 mass % of the (meth)acrylic polymer (A) and a (meth)acrylic polymer (Ah) having a glass transition temperature of 50° C. or higher, a percentage content of the (meth)acrylic polymer (Ah) is less than 25 mass %. (I) The (meth)acrylic polymer (A) is a polymer of a monomer component that contains 19 mass % or more of a monomer (a1) that does not have a crosslinkable functional group. (II) A homopolymer of the monomer (a1) has a glass transition temperature of 0° C. or higher.

The presently claimed invention relates to a polymer emulsion and a process for preparing a polymer emulsion. Particularly, the presently claimed invention relates to a process for preparing a polymer emulsion with high solids content.

An acrylic emulsion pressure-sensitive adhesive composition is provided. More particularly, an acrylic emulsion pressure-sensitive adhesive composition that may become easily removable when being impregnated with water in a water-borne removal process while being able to realize excellent tacky/adhesive strength for a substrate to be adhered is provided.

An acrylic emulsion pressure-sensitive adhesive composition is provided. More particularly, an acrylic emulsion pressure-sensitive adhesive composition that may become easily removable when being impregnated with water in a water-borne removal process while being able to realize excellent tacky/adhesive strength for a substrate to be adhered is provided.