The present invention relates to an acrylic resin powder containing a multistage polymer (G) having an alkyl (meth)acrylate ester (ma) monomer unit and an alkyl (meth)acrylate ester (mb) monomer unit, in which an alkyl group in the alkyl (meth)acrylate esters (ma) and (mb) has 4 to 8 carbon atoms, a glass transition temperature of the multistage polymer (G) is 50° C. or higher, a mass average molecular weight is 10,000 or more and 300,000 or less, a softening temperature that is measured by a flow tester temperature-rising method is 150° C. to 200° C., and the acrylic resin powder is soluble in acetone.

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

Provided is a polymer compound having a repeating unit represented by Formula 1A below:

##STR00001##

wherein in Formula 1A, Z.sup.1 represents a hydrogen atom or a monovalent group, R.sup.1 represents a group represented by Formula 1B, L.sup.1 represents a divalent group, n represents an integer of 1 or more, and in in Formula 1B, L.sup.2 represents a single bond or a divalent group, R.sup.2 represents a group selected from the group consisting of a hydroxy group and a group represented by *—OR.sup.3, R.sup.3 represents a hydrocarbon group which may have a hetero atom, a plurality of R.sup.3's may be bonded to each other to form a ring, * represents a bonding position, m represents an integer of 1 to 5, and a plurality of L.sup.1's and a plurality of R.sup.2's may be the same as or different from each other.

Provided is a polymer compound having a repeating unit represented by Formula 1A below:

##STR00001##

wherein in Formula 1A, Z.sup.1 represents a hydrogen atom or a monovalent group, R.sup.1 represents a group represented by Formula 1B, L.sup.1 represents a divalent group, n represents an integer of 1 or more, and in in Formula 1B, L.sup.2 represents a single bond or a divalent group, R.sup.2 represents a group selected from the group consisting of a hydroxy group and a group represented by *—OR.sup.3, R.sup.3 represents a hydrocarbon group which may have a hetero atom, a plurality of R.sup.3's may be bonded to each other to form a ring, * represents a bonding position, m represents an integer of 1 to 5, and a plurality of L.sup.1's and a plurality of R.sup.2's may be the same as or different from each other.

An adhesive layer (20a) has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.

An adhesive layer (20a) has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic copolymer having a dissolution rate to a developer in a specific range and a compound containing a phenolic hydroxyl group, so that it is possible to attain a high contrast and a high sensitivity pattern when a cured film is formed. Further, it is possible to further enhance the adhesiveness of a pattern when a half-tone, as well as a full-tone, is formed.