An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present.

The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

An automatic dishwashing composition is provided, comprising: a dispersant polymer blend, comprising an acrylic acid homopolymer; and a copolymer of acrylic acid and a sulfonated monomer; wherein the dispersant polymer blend has a blend ratio of the acrylic acid homopolymer to the copolymer of 3:1 to 1:3; a surfactant; a builder; and optionally, an additive.

Phosphate-free automatic dishwashing detergent composition including a new amylase.

Bleach-containing automatic dishwashing cleaning composition including a new amylase.

The present invention relates to a method of making a solid cleaning composition. The method can include pressing and/or vibrating a flowable solid of a self-solidifying cleaning composition. For a self-solidifying cleaning composition, pressing and/or vibrating a flowable solid determines the shape and density of the solid but is not required for forming a solid. The method can employ a concrete block machine for pressing and/or vibrating. The present invention also relates to a solid cleaning composition made by the method and to solid cleaning compositions including particles bound together by a binding agent.

The invention relates to a process for preparing a cationic polymer thickener in particle form, said polymer consisting of a crosslinked water swellable cationic polymer comprising at least one cationic water soluble monomer and optionally at least one non-ionic water soluble monomer and/or at least one anionic water soluble monomer, wherein said polymer has a water extractable polymer content lower than 15 wt % as compared to the weight of the polymer, and wherein said polymer is obtained by gel polymerization of said monomers in the presence of from 500 ppm to 10.000 ppm of crosslinking agent relative to the weight of the monomers.

A semiconductor cleaning agent containing a sulfonic acid group-containing polymer, wherein a content of at least one metal selected from the group consisting of Na, Al, K, Ca and Fe is 0.7 ppm or less.

The purpose of the present invention is to provide means for sufficiently removing residues on a surface of an object which has been polished including silicon nitride, silicon oxide, or polysilicon. Provided is a composition for surface treatment including an anionic surfactant having a molecular weight of 1,000 or less and water, the composition having a pH of less than 7, wherein a ratio of a molecular weight of a hydrophilic moiety to a molecular weight of a hydrophobic moiety (the molecular weight of the hydrophilic moiety/the molecular weight of the hydrophobic moiety) of the anionic surfactant is 0.4 or more (in which the hydrophobic moiety is a hydrocarbon group having 4 or more carbon atoms and the hydrophilic moiety is a part excluding the hydrophobic moiety and a counterion), and the composition for surface treatment is used for surface treatment of an object which has been polished including at least one selected from the group consisting of silicon nitride, silicon oxide, and polysilicon.

A liquid laundry additive is provided, comprising a cleaning booster polymer having structural units of a monoethylenically unsaturated carboxylic acid monomer; structural units of an ethylenically unsaturated monomer of formula (I)

##STR00001##

optionally, structural units of an ethylenically unsaturated monomer of formula (III)

##STR00002##

and optionally, structural units of an ethylenically unsaturated monomer of formula (IV)

##STR00003##

An automatic dishwashing composition is provided including a builder; a phosphonate; a nonionic surfactant; and a dispersant polymer, comprising: (a) 50 to 95 wt %, based on weight of the dispersant polymer, of structural units of a monoethylenically unsaturated monocarboxylic acid monomer; and (b) 5 to 50 wt %, based on weight of the dispersant polymer, of structural units of a sulfate bearing ethylenically unsaturated monomer.