The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.

The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.

There is provided a piezoelectric stack, including: a substrate; an oxide film on the substrate, containing zinc and oxygen as main elements; an electrode film on the oxide film; and a piezoelectric film on the electrode film, being an alkali niobium oxide film containing potassium, sodium, niobium, and oxygen and having a perovskite structure.

Provided are an alloy coating steel plate and a method of manufacturing the same, and in this case, the alloy coating steel plate includes a steel, and an Al—Mg—Si alloy layer positioned on the steel plate, wherein the Al—Mg—Si alloy layer is formed to include Mg—Si alloy grains in an alloy layer configured in an Al—Mg alloy phase.

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 μm or more and equal to or less than a thickness of the Cu plating layer.

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.

A superconducting device which includes a substrate, multiple niobium leads formed on the substrate, a niobium silicide (NbSi.sub.x) passivation layer formed on a surface of at least one of the multiple niobium leads, and an aluminum lead formed directly on at least a portion of the NbSi.sub.x passivation layer such that an interface therebetween is substantially free of oxygen and oxidized material, where the multiple niobium leads and the aluminum lead are constructed to carry a supercurrent while in use.

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm.sup.2 and 5 billion cm.sup.2.

A layer system includes at least one bonding layer and a plurality of functional layers arranged on the at least one bonding layer. Each functional layer has a first nanolayer of a first metal nitride with a first metal constituent, and a metallic second nanolayer. Each functional layer has a layer thickness d in a range of 1 to 100 nm.

Provided is a technique of forming an aluminum film that has high flatness and less cavities. Step S11 is forming a first film having a thickness that is equal to or greater than 0.1 μm and less than 1 μm, by sputtering a material onto a substrate. Step S12 is reflowing the first film by heating the first film. Step S13 is forming a second film by sputtering the material onto the first film that has been reflowed. Step S14 is reflowing the second film by heating the second film. Step S15 is forming a third film by sputtering the material onto the second film that has been reflowed. Step S16 is reflowing the third film by heating the third film.