A nanoparticle coater includes a housing; a nanoparticle discharge slot; a first combustion slot; and a second combustion slot.

Sputtering targets including molybdenum, niobium and tantalum are found to be useful for sputtering films for electronic devices. Sputtering targets with about 88 to 97 weight percent molybdenum show improved performance, particularly with respect to etching, such as when simultaneously etching an alloy layer including the Mo, Nb, and Ta, and a metal layer (e.g., an aluminum layer). The targets are particularly useful in manufacturing touch screen devices.

A method for preparing a NdFeB permanent magnetic material may include providing a covered NdFeB magnetic powder by depositing heavy rare earth particles or high-melting particles onto a NdFeB magnetic powder by physical vapor deposition; and performing orientation molding and sintering on the covered NdFeB magnetic powder to provide the NdFeB permanent magnetic material.

The present invention relates to a hydrophilic metal thin film, which is formed by stacking a plurality of columnar structures. A plurality of tetrahedral structures is on the surface of the hydrophilic metal film, which is formed on the top of the columnar structures. The width of the tetrahedral structures is 15 nm to 120 nm. The hydrophilic metal thin film comprises: 35 to 95 at % of iron, 5 to 20 at % of chromium. The above-mentioned hydrophilic metal thin film is formed by magnetron sputtering method under the working pressure of argon gas ranging from 6 mTorr to 13 mTorr, and the sputtering time exceeds 20 minutes.

A method is disclosed for enhancing adhesion of a decorative metal layer to a polymeric primer that is a film on the surface of a substrate produced by a low-temperature cure. Substrates to which the polymeric primer is applied include metal, plastic or carbon fiber. The polymeric primer layer is treated with a plasma enhanced chemical vapor deposition to form a polysiloxane bonding interface layer to enhance the surface of the polymer primer layer to increase adhesion of the decorative metal layer deposited without the need for the use of specially made primers specifically made for the reception of metal layers applied physical vapor deposition.

Describes are shutter disks comprising one or more of titanium (Ti), barium (Ba), or cerium (Ce) for physical vapor deposition (PVD) that allows pasting to minimize outgassing and control defects during etching of a substrate. The shutter disks incorporate getter materials that are highly selective to reactive gas molecules, including O.sub.2, CO, CO.sub.2, and water.

A substrate processing apparatus for performing a predetermined processing on a substrate includes a power supply device configured to supply a DC power. The power supply device includes a power supply and a current detection unit configured to detect a current value of a DC power from the power supply. The current detection unit includes a plurality of current sensors used for detecting the current value in the current detection unit and having different detection ranges for the current value, and a switching unit configured to switch the current sensors. The power supply is controlled such that the DC power from the power supply is maintained at a set value based on a detection result of the current detection unit, and the switching unit switches the current sensors depending on the set value of the DC power from the power supply.

A structure in which a plurality of particles each containing a hydrogen absorption metal element are arranged in a fixed member such that the plurality of particles are apart from each other. An entire surface of each of the plurality of particles is surrounded by the fixed member. The fixed member contains at least one of an oxide and a nitride.

A coated substrate includes a substrate, a zirconium-containing layer disposed over the substrate, and one or more copper alloy layers disposed over the substrate. Variations include coated substrate with a single copper alloy layer, alternating copper layers, or a combined copper alloy/zirconium-containing layer.

A coated substrate includes a base substrate and a base layer disposed over the substrate. Typically, the base layer is composed of a component selected from the group consisting of zirconium carbonitrides, zirconium oxycarbides, titanium carbonitrides, titanium oxycarbides, and combinations thereof. One or more copper-containing antimicrobial layers are disposed over the base layer such that each of the one or more copper-containing antimicrobial layers includes copper atoms in the +1 oxidation state and/or the +2 oxidation state.