A method for dielectric filling of a feature on a substrate yields a seamless dielectric fill with high-k for narrow features. In some embodiments, the method may include depositing a metal material into the feature to fill the feature from a bottom of the feature wherein the feature has an opening ranging from less than 20 nm to approximately 150 nm at an upper surface of the substrate and wherein depositing the metal material is performed using a high ionization physical vapor deposition (PVD) process to form a seamless metal gap fill and treating the seamless metal gap fill by oxidizing/nitridizing the metal material of the seamless metal gap fill with an oxidation/nitridation process to form dielectric material wherein the seamless metal gap fill is converted into a seamless dielectric gap fill with high-k dielectric material.

The present disclosure generally relates to a storage device comprising soft bias structures having high coercivity and high anisotropy, and a method of forming thereof. The soft bias structures may be formed by moving a wafer in a first direction under a plume of NiFe to deposit a first NiFe layer at a first angle, moving the wafer in a second direction anti-parallel to the first direction to deposit a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The soft bias structures may be formed by rotating a wafer to a first position, depositing a first NiFe layer at a first angle, rotating the wafer to a second position, depositing a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The first and second NiFe layers have different grain structures.

Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 μm or more and equal to or less than a thickness of the Cu plating layer.

Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.

A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.

A coated tool for hot stamping of coated or uncoated sheet metals, comprising a coated substrate surface to be in contact with the coated or uncoated metal sheet, wherein the coating in the coated substrate surface comprises one or more inferior layers and one or more superior layers, where the inferior layers are deposited closer to the substrate surface than the superior layers, and: the inferior layers are designed for providing load bearing capacity, the superior layers are designed for providing galling resistance, at least one superior layer is deposited having a multi-nanolayer structure wherein: one type of nanolayer is composed of at least 90 at.-% of chromium and nitrogen, a second type of nanolayer is composed of at least 90 at.-% of titanium, aluminum and nitrogen, a third type of nanolayer is composed of at least 90 at.-% of vanadium carbon and nitrogen.

Provided are a low-price fuel cell separator with high corrosion resistance and a method for manufacturing the separator. The present disclosure relates to a fuel cell separator including a metal substrate and a titanium layer containing titanium formed on the metal substrate, and a method for manufacturing the separator. A ratio of a (100) plane to a sum of values obtained by dividing peak intensities of the (100) plane, a (002) plane, and a (101) plane derived from titanium in an X-ray diffraction analysis of a separator surface by respective relative intensities is a constant value or more.

The tantalum-doped molybdenum disulfide/tungsten disulfide (MoS.sub.2/WS.sub.2) multi-layer film includes a titanium transition layer, a titanium/tantalum/molybdenum disulfide/tungsten disulfide (Ti/Ta/MoS.sub.2/WS.sub.2) multi-layer gradient transition layer, and a tantalum-doped MoS.sub.2/WS.sub.2 multi-layer layer which are successively laminated in a thickness direction. The preparation method includes: successively depositing the titanium transition layer, the Ti/Ta/MoS.sub.2/WS.sub.2 multi-layer gradient transition layer, and the tantalum-doped MoS.sub.2/WS.sub.2 multi-layer layer on the surface of a matrix by adopting a magnetron sputtering technology to obtain the tantalum-doped MoS.sub.2/WS.sub.2 multi-layer film. The tantalum-doped MoS.sub.2/WS.sub.2 multi-layer film has good matrix binding strength, hardness and elasticity modulus, good friction and abrasion performance, good temperature self-adopting performance, heat and humidity resistance, and high temperature oxidization resistance under an atmospheric environment at different temperatures, and can meet the requirements of stable lubrication and long-life service of aerospace vehicles.

Provided is a method for producing a photocatalyst electrode for water decomposition that exhibits excellent detachability between the substrate and the photocatalyst layer and exhibits high photocurrent density. The method for producing a photocatalyst electrode for water decomposition of the invention includes: a metal layer forming step of forming a metal layer on one surface of a first substrate by a vapor phase film-forming method or a liquid phase film-forming method; a photocatalyst layer forming step of forming a photocatalyst layer by subjecting the metal layer to at least one treatment selected from an oxidation treatment, a nitriding treatment, a sulfurization treatment, or a selenization treatment; a current collecting layer forming step of forming a current collecting layer on a surface of the photocatalyst layer, the surface being on the opposite side of the first substrate; and a detachment step of detaching the first substrate from the photocatalyst layer.