C23C14/30

METHODS OF ALTERING THE SURFACE ENERGY OF COMPONENTS OF A MESH NEBULIZER AND MESH NEBULIZERS FORMED THEREBY

Methods of altering the surface energy of components of a mesh nebulizer are provided, comprising: a) depositing a metal surface layer on surfaces of the component; b) forming a hydrophobic coating layer comprising an organo-silicon or a self-assembled monolayer of an organophosphorus acid directly on the metal surface layer or indirectly on the metal surface layer through an intermediate organometallic coating; and either: i) removing select areas of the hydrophobic coating layer to expose the metal surface layer; or ii) forming a polymeric coating layer chemically bonded to and propagated from terminal functional groups on the hydrophobic coating layer that are capable of initiating polymer growth when exposed to a source of polymerizable monomer, on select areas of the components. Mesh nebulizers formed by such methods are also provided.

METHODS OF ALTERING THE SURFACE ENERGY OF COMPONENTS OF A MESH NEBULIZER AND MESH NEBULIZERS FORMED THEREBY

Methods of altering the surface energy of components of a mesh nebulizer are provided, comprising: a) depositing a metal surface layer on surfaces of the component; b) forming a hydrophobic coating layer comprising an organo-silicon or a self-assembled monolayer of an organophosphorus acid directly on the metal surface layer or indirectly on the metal surface layer through an intermediate organometallic coating; and either: i) removing select areas of the hydrophobic coating layer to expose the metal surface layer; or ii) forming a polymeric coating layer chemically bonded to and propagated from terminal functional groups on the hydrophobic coating layer that are capable of initiating polymer growth when exposed to a source of polymerizable monomer, on select areas of the components. Mesh nebulizers formed by such methods are also provided.

APPARATUS AND METHOD FOR DEPOSITING HARD CARBON LAYERS

An apparatus and method for depositing a carbon layer includes an arc discharge is formed between an electron source and an evaporation material by means of a first power supply device. The negative terminal of the first power supply device is connected in an electrically conducting manner to the electron source and the positive terminal of the first power supply device is connected in an electrically conducting manner to the evaporation material. A permanent magnet system and a solenoid coil are arranged in a rotationally symmetrical manner around the evaporation material. The evaporation material is formed as a graphite rod which is surrounded by at least one heat-insulating element at least on the rod end to be evaporated of the graphite rod.

FORMING METHOD OF PLASMA RESISTANT OXYFLUORIDE COATING LAYER
20230215701 · 2023-07-06 ·

The present invention relates to a method of forming a plasma resistant oxyfluoride coating layer, including: mounting a substrate on a substrate holder provided in a chamber; causing an electron beam scanned from an electron gun to be incident on an oxide evaporation source accommodated in a first crucible, and heating, melting, and vaporizing the oxide evaporation source as the electron beam is incident on the oxide evaporation source; vaporizing a fluoride accommodated in a second crucible; and advancing an evaporation gas generated from the oxide evaporation source and a fluorine-containing gas generated from the fluoride toward the substrate, and reacting the evaporation gas generated from the oxide evaporation source and the fluorine-containing gas generated from the fluoride to deposit an oxyfluoride on the substrate. According to the present invention, it is possible to form a dense and stable oxyfluoride coating layer having excellent plasma resistance, suppressed generation of contaminant particles, and no cracks.

FORMING METHOD OF PLASMA RESISTANT OXYFLUORIDE COATING LAYER
20230215701 · 2023-07-06 ·

The present invention relates to a method of forming a plasma resistant oxyfluoride coating layer, including: mounting a substrate on a substrate holder provided in a chamber; causing an electron beam scanned from an electron gun to be incident on an oxide evaporation source accommodated in a first crucible, and heating, melting, and vaporizing the oxide evaporation source as the electron beam is incident on the oxide evaporation source; vaporizing a fluoride accommodated in a second crucible; and advancing an evaporation gas generated from the oxide evaporation source and a fluorine-containing gas generated from the fluoride toward the substrate, and reacting the evaporation gas generated from the oxide evaporation source and the fluorine-containing gas generated from the fluoride to deposit an oxyfluoride on the substrate. According to the present invention, it is possible to form a dense and stable oxyfluoride coating layer having excellent plasma resistance, suppressed generation of contaminant particles, and no cracks.

Metal-oxide semiconductor evaporation source equipped with variable temperature control module

A metal-oxide electron-beam evaporation source including a variable temperature control device according to the present invention includes: a crucible configured to store a deposition material which is formed of a metal oxide and over which an electron beam is directly scanned; N heating units provided in an outer portion of the crucible, dividing the crucible into N regions, and provided for N regions, respectively; and a control unit configured to control the N heating units so that a temperature of an upper region of the crucible is maintained to be higher than that of a lower region of the crucible to reduce a temperature difference between a region over which the electron beam is scanned and a region over which the electron beam is not scanned.

Metal-oxide semiconductor evaporation source equipped with variable temperature control module

A metal-oxide electron-beam evaporation source including a variable temperature control device according to the present invention includes: a crucible configured to store a deposition material which is formed of a metal oxide and over which an electron beam is directly scanned; N heating units provided in an outer portion of the crucible, dividing the crucible into N regions, and provided for N regions, respectively; and a control unit configured to control the N heating units so that a temperature of an upper region of the crucible is maintained to be higher than that of a lower region of the crucible to reduce a temperature difference between a region over which the electron beam is scanned and a region over which the electron beam is not scanned.

Nanoparticle formation mitigation in a deposition process

A system for depositing coating on a workpiece includes a deposition chamber within which is formed a vortex to at least partially surround a workpiece therein.

Nanoparticle formation mitigation in a deposition process

A system for depositing coating on a workpiece includes a deposition chamber within which is formed a vortex to at least partially surround a workpiece therein.

METHOD FOR MANUFACTURING OPTICAL LENS PROVIDED WITH ANTI-REFLECTION FILM
20220413186 · 2022-12-29 · ·

A method for manufacturing an optical lens using an ion-assisted deposition apparatus that comprises an ion source includes: forming, on a lens substrate made of a material containing 40 mass % or more of fluoride, a first lower layer of an anti-reflection film of the optical lens, wherein the first lower layer is a fluoride layer; forming, on the first lower layer, a second lower layer of the anti-reflection film; forming on the second lower layer, one or more intermediate layers of the antireflection film; forming, on the one or more intermediate layers, an uppermost layer of the anti-reflection film; and irradiating, using the ion source, the lens substrate with ions.