Patent classifications
C23C16/342
Method and apparatus for preparing boron nitride nanotubes by heat treating boron precursor prepared by using air-jet
A method and apparatus for preparing boron nitride nanotubes (BNNTs) according to an embodiment may ensure mass-production, may increase yield by reducing a production time, and may prepare BNNTs with high purity.
Two-dimensional material device and method for manufacturing same
By widening a terrace on a crystal surface on a bottom face of a recess by step flow caused by heating, a flat face is formed on the bottom face of the recess, a two-dimensional material layer made of a two-dimensional material is formed on the formed flat face, and then a device made of the two-dimensional material layer is produced.
METHOD AND SYSTEM FOR DEPOSITING BORON NITRIDE USING PULSED CHEMICAL VAPOR DEPOSITION
Methods and systems for depositing a boron nitride film on a substrate are disclosed. More particularly, the disclosure relates to methods and systems that can be used for depositing a boron nitride film by a pulsed CVD process.
ELECTRON EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME
Provided in the present disclosure is an electron emitting element 10 including a laminated structure in which a first electrode 1, an electron accelerating layer 6 made of an insulation film, a second electrode 3, and a cover film 7 are laminated in that order, in which the second electrode is an electrode which transmits electrons and emits electrons from a surface thereof, and the cover film is a film which transmits electrons, is a protective film made of a material different from that of the second electrode, and constitutes an electron emission surface 5.
Method for preparing multi-layer hexagonal boron nitride film
The present disclosure provides a method for preparing a multi-layer hexagonal boron nitride film, including: preparing a substrate; preparing a boron-containing solid catalyst, and disposing the boron-containing solid catalyst on the substrate; annealing the boron-containing solid catalyst to melt the boron-containing solid catalyst; feeding a nitrogen-containing gas and a protecting gas to an atmosphere in which the melted boron-containing solid catalyst resides, the nitrogen-containing gas reacts with the boron-containing solid catalyst to form the multi-layer hexagonal boron nitride film on a surface of the substrate. The method for preparing a multi-layer hexagonal boron nitride film can prepare a hexagonal boron nitride film having a lateral size in the order of inches and a thickness from several nanometers to several hundred nanometers on the surface of the substrate, providing a favorable basis for the application of hexagonal boron nitride in the field of two-dimensional material devices.
CASTING MOLD AND METHODS FOR PRODUCTION
The invention relates to a method for producing a casting mold as well as to a casting mold (10), in particular a continuous casting mold or similar. Said casting mold is made of a material which is essentially made of carbon and the casting mold is coated with pyrolytic carbon and/or boron nitride.
METHOD FOR COATING SHORT FIBRES
A method for coating fibres includes coating short fibres having an average length less than or equal to 5 mm by chemical vapour deposition in a fluidised bed, the short fibres treated being made of ceramic material or carbon and being mixed with spacer particles distinct from the short fibres, the spacer particles having an average diameter greater than or equal to 20 μm.
Deposition of low-stress boron-containing layers
Examples of the present technology include semiconductor processing methods to form boron-containing materials on substrates. Exemplary processing methods may include delivering a deposition precursor that includes a boron-containing precursor to a processing region of a semiconductor processing chamber. A plasma may be formed from the deposition precursor within the processing region of the semiconductor processing chamber. The methods may further include depositing a boron-containing material on a substrate disposed within the processing region of the semiconductor processing chamber, where the substrate is characterized by a temperature of less than or about 50° C. The as-deposited boron-containing material may be characterized by a surface roughness of less than or about 2 nm, and a stress level of less-than or about −500 MPa. In some embodiments, a layer of the boron-containing material may function as a hardmask.
STRUCTURES FORMED FROM HIGH TECHNOLOGY CONDUCTIVE PHASE MATERIALS
A method of forming a bulk product includes the step of coating a particulate conductive phase material with a binder phase, and forming the coated conductive phase material into at least one of sheet stock, tape formed into a bulk material. A method of forming a bulk product includes the step of coating a particulate conductive phase material with a binder phase and forming the coated conductive phase material into a bulk material. The conductive phase material includes at least one of two dimensional materials, single layer materials, carbon nanotubes, boron nitride nanotubes, aluminum nitride and molybdenum disulphide (MoS.sub.2). A component is also disclosed.
AUTOMATED PREPARATION METHOD OF A SICF/SIC COMPOSITE FLAME TUBE
An automated preparation method of a SiC.sub.f/SiC composite flame tube, comprising the following steps: preparing an interface layer for a SiC fiber by a chemical vapor infiltration process, and obtaining the SiC fiber with a continuous interface layer; laying a unidirectional tape on the SiC fiber with the continuous interface layer and winding the SiC fiber with the continuous interface layer to form and obtaining a preform of a net size molding according to a fiber volume and a fiber orientation obtained in a simulation calculation; and adopting a reactive melt infiltration process and the chemical vapor infiltration process successively for a densification and obtaining a high-density SiC.sub.f/SiC composite flame tube in a full intelligent way. The SiC.sub.f/SiC composite flame tube prepared by the present disclosure not only has a high temperature resistance, but also has a low thermal expansion coefficient, high thermal conductivity and high thermal shock resistance.