Patent classifications
C23C16/409
REACTIVE THERMAL BARRIER COATING
A calcium-magnesium-alumino-silicate (CMAS)-reactive thermal barrier coating includes a ceramic coating and a CMAS-reactive overlay coating, wherein the CMAS-reactive overlay coating conforms to a surface of the ceramic coating and comprises a compound that forms a stable high melting point crystalline precipitate when reacted with molten CMAS at a rate that is competitive with CMAS infiltration kinetics into the thermal barrier coating. The ceramic coating phase is stable with the CMAS-reactive overlay coating.
MXENE LAYERS AS SUBSTRATES FOR GROWTH OF HIGHLY ORIENTED PEROVSKITE THIN FILMS
The present disclosure is directed to using MXene compositions as templates for the deposition of oriented perovskite films, and compositions derived from such methods. Certain specific embodiments include methods preparing an oriented perovskite, perovskite-type, or perovskite-like film, the methods comprising: (a) depositing at least one perovskite, perovskite-type, or perovskite-like composition or precursor composition using chemical vapor deposition (CVD), physical vapor deposition (PVD), or atomic layer deposition (ALD) onto a film or layer of a MXene composition supported on a substrate to form a layered composition or precursor composition; and either (b) (1) heat treating or annealing the layered precursor composition to form a layered perovskite-type structure comprising at least one oriented perovskite, perovskite-type, or perovskite-like composition; or (2) annealing the layered composition; or (3) both (1) and (2).
METAL-ORGANIC PULSED LASER DEPOSITION FOR STOICHIOMETRIC COMPLEX OXIDE THIN FILMS
Methods and systems for forming complex oxide films are provided. Also provided are complex oxide films and heterostructures made using the methods and electronic devices incorporating the complex oxide films and heterostructures. In the methods pulsed laser deposition is conducted in an atmosphere containing a metal-organic precursor to form highly stoichiometric complex oxides.
DEPOSITION AND TEXTURE CONTROL OF PBTIO3, PBZRO3, AND PBZRXTI1-XO3
A method of depositing a thin film of lead titanate (PTO), lead zirconate (PZO) or lead zirconate titanate (PZT) comprising depositing a PTO, PZO or PZT layer upon a substrate whereby growth occurs primarily due to self-limited surface chemisorption of pulsed chemical vapor, and annealing the PTO, PZO, or PZT layer and substrate.
PROCESS FOR PASSIVATING DIELECTRIC FILMS
Methods are disclosed herein for depositing a passivation layer comprising fluorine over a dielectric material that is sensitive to chlorine, bromine, and iodine. The passivation layer can protect the sensitive dielectric layer thereby enabling deposition using precursors comprising chlorine, bromine, and iodine over the passivation layer.
STRUCTURE FOR USE IN A METAL-INSULATOR-METAL CAPACITOR
The disclosed technology relates to a structure for use in a metal-insulator-metal capacitor. In one aspect, the structure comprises a bottom electrode formed of a Ru layer. The Ru layer has a top surface characterized by a grazing incidence X-ray diffraction spectrum comprising a first intensity and a second intensity, the first intensity corresponding to a diffracting plane of Miller indices (0 0 2) being larger than the second intensity corresponding to a diffracting plane of Miller indices (1 0 1). The structure further comprises an interlayer on the top surface of the Ru layer, the interlayer being formed of an oxide of Sr and Ru having a cubic lattice structure, and a dielectric layer on the interlayer, the dielectric layer being formed of an oxide of Sr and Ti.
ALTERNATING MULTI-SOURCE VAPOR TRANSPORT DEPOSITION
Disclosed are vapor transport deposition systems and methods for alternating sequential vapor transport deposition of multi-component perovskite thin-films. The systems include multiple vaporizing sources that are mechanically or digitally controlled for high throughput deposition. Alternating sequential deposition provides faster sequential deposition, and allows for reduced material degradation due to different vapor temperatures.
Process for passivating dielectric films
Methods are disclosed herein for depositing a passivation layer comprising fluorine over a dielectric material that is sensitive to chlorine, bromine, and iodine. The passivation layer can protect the sensitive dielectric layer thereby enabling deposition using precursors comprising chlorine, bromine, and iodine over the passivation layer.
High-Crystallinity Barium Titanate Film Structure, Method of Preparation and Application Thereof
The present invention provides a high-crystallinity barium titanate film structure, a method of preparation and an application thereof, and relates to the field of materials and devices. The method includes the steps of depositing, on a substrate, a barium titanate layer with a (001) or (111) crystal orientation by atomic layer deposition in a high vacuum environment and at a low temperature of 450? C. or below, wherein a Ba/Ti ratio in the barium titanate layer is 0.9-1.5; and performing plasma annealing treatment on the barium titanate layer at a low temperature of 450? C. or below without breaking vacuum to form a high-crystallinity barium titanate layer having the (001) or (111) crystal orientation. The film structure may further comprise top and bottom electrodes formed above and below the barium titanate layer. The present invention solves the problem that an existing method for obtaining a crystalline BTO film is not applicable to back-end of line (BEOL) integration processes.
MANUFACTURE EQUIPMENT FOR LARGE-AREA PEROVSKITE FILM
A manufacture equipment for a large-area perovskite film, includes a vacuum chamber provided with a substrate heater therein for accommodating a substrate; a first evaporation case and a second evaporation case are disposed under the substrate heater in the vacuum chamber, the first evaporation case is embedded above the second evaporation case, a damper is disposed between the first evaporation case and the substrate heater; a first heater is disposed on the bottom of the first evaporation case, which is connected with a first carrier-gas pipe communicating with an external carrier-gas source; a second heater is disposed on the bottom of the second evaporation case, the second evaporation case is connected with a second carrier-gas pipe communicating with an external carrier-gas source. With the equipment, reaction species can be sprayed onto a substrate with carrier-gases and react to form perovskite film, which improves uniformity of the perovskite film.