Apparatus and methods for supplying a vapor to a processing chamber such as a film deposition chamber are described. The vapor delivery apparatus comprises an inlet conduit and an outlet conduit, in fluid communication with an ampoule. A needle valve device restricts flow through the outlet conduit.

Apparatus and methods for supplying a vapor to a processing chamber are described. The vapor delivery apparatus comprises an inlet conduit and an outlet conduit, each with two valves, in fluid communication with an ampoule. A bypass conduit connects the inlet conduit and the outlet conduit. A flow restrictive device restricts flow through the outlet conduit.

A concentration control apparatus capable of appropriately making a zero adjustment of a concentration measurement mechanism without interrupting a semiconductor manufacturing process includes: a control valve that controls gas flowing through a lead-out flow path; a concentration measurement mechanism that measures the concentration of source gas contained in gas flowing through the lead-out flow path; a concentration controller that controls the control valve so that the deviation between measured concentration measured by the concentration measurement mechanism and preset set concentration decreases; a judgement time point determination part that determines a judgement time point that is the time point when the gas present in a measurement part where the concentration measurement mechanism performs the concentration measurement has been replaced with other gas; and a zero adjustment part that makes a zero adjustment of the concentration measurement mechanism at or after the judgement time point.

The present disclosure relates, in part, to an apparatus for controlling the concentration of a component within a gas mixture. In particular embodiments, the component is a vaporized liquid component, such as a vaporized stabilizer or a vaporized precursor. Also described are systems thereof and methods for such control.

Improved selective atomic layer deposition of metal oxides is provided that has large-ligand (i.e., molecular weight >20) metal precursors. A small molecule inhibitor on non-growth surfaces is used to distinguish growth surfaces from non-growth surfaces. This approach does not rely on formation of a self-assembled monolayer on the non-growth surfaces.

A method for producing a doping raw-material solution for film formation includes a step of firstly mixing a solute including a halogen-containing organic dopant compound or a dopant halide with a first solvent, but not with other solvents to prepare a dopant precursor solution separately from a film-forming raw material, where an acidic solvent is used as the first solvent. A method for producing a doping raw-material solution for film formation enables stable formation of a high-quality thin film having excellent electric characteristics.

A method for treating a carbon or ceramic yarn includes forming a coating on the yarn in a reaction zone of a reactor by heating a segment of the yarn in the presence of a gas phase in a microwave field, wherein the gas phase includes a mixture of a diluent gas and a coating precursor in the vapor state, and wherein the gas phase is formed at least by introducing the diluent gas into the reactor and mixing the introduced diluent gas with the coating precursor in the reactor before the reaction zone.

A method for forming a transition metal dichalcogenide monolayer, which includes depositing a transition metal, a transition metal oxide, or a mixture thereof, on a substrate, introducing a chalcogen precursor to the transition metal, the transition metal oxide, or the mixture thereof, in the presence of an etching gas and a carrier gas at a first temperature, to form a transition metal dichalcogenide on the substrate from the transition metal, the transition metal oxide, or the mixture thereof, and subliming the transition metal dichalcogenide on the substrate in the presence of a pulsating supply of a vapor of the chalcogen precursor to form the transition metal dichalcogenide monolayer at a second temperature, wherein the vapor of the chalcogen precursor comprises a chalcogen vapor.

Systems and methods for controlling precursor delivery. The systems and methods may comprise a precursor delivery vessel in fluid communication with a gas flow line. The precursor delivery vessel may comprise at least one tray containing a vaporizable precursor. An amount of thermal energy may be supplied to the at least one tray in an amount sufficient to vaporize the vaporizable precursor. The vaporized precursor may be dispensed from the precursor delivery vessel to the gas flow line. The amount of thermal energy supplied to the at least one tray may be adjusted sufficient to maintain a pressure of the vaporized precursor, in the gas flow line, within a pressure range.

In a concentration controller that intermittently leads out material gas from a vaporization tank, in order to control the flow rates of carrier and diluent gases so that the concentration of the material gas can be suppressed from overshooting immediately after the start of material gas supply period, the concentration controller is adapted to include: a concentration calculation part that calculates the concentration of the material gas on the basis of an output signal from a concentration monitor; and a set flow rate calculation part that, on the basis of actual concentration calculated by the concentration calculation part, an actual flow rate outputted from a flow rate control device or the set flow rate of the flow rate control device, and a preset target concentration, calculates the initial set flow rate of the flow rate control device.