The present invention relates to a method for preventing the metallization of a support of at least one plastic part subjected to a metallization process, comprising the successive stages of oxidation of the surface of said part, of activation of the oxidized surface and of chemical and/or electrochemical deposition of metal on the activated surface, characterized in that it comprises a stage in which said support, before said oxidation stage, is brought into contact with an inhibiting solution comprising at least one specific metallization inhibitor. The invention also relates to a process for the selective metallization of a plastic part combined with a support, comprising bringing said part into contact with said inhibiting solution.

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

A belt for an elevator system includes a plurality of tension members arranged along a belt width, a jacket material at least partially encapsulating the plurality of tension members defining a traction surface, a back surface opposite the traction surface together with the traction surface defining a belt thickness, and two end surfaces extending between the traction surface and the back surface defining the belt width. A metallic coating layer applied from a liquid solution is positioned over at least one end surface of the two end surfaces.

A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plateable material portion 31 is made of SiO.sub.2 as a main component, and the plateable material portion 32 is made of a material including, as a main component, a material containing at least one of a OCH.sub.x group and a NH.sub.x group, a metal material containing Si as a main component, a material containing carbon as a main component or a catalyst metal material.

Tubulars are immersed in electroless nickel coating solution to coat the tubulars. Prior to the coating step the tubulars are blasted with a clean medium and washed and rinsed in alkaline solution. The tubulars are arranged in a bunk for washing, rinsing and coating. LLDPE stretch wrap applied to outer portions of the tubulars prevents coating of the outer portions. The tubulars are electrically separated from the bunk and the coating solution tank, and the tank is provided with anodic protection to prevent coating of the tank. The bunk is provided with a header assembly to provide solution flow through the tubulars via nozzles on the header assembly in addition to flow caused by the vortex effect created by velocity of fluid exiting the nozzles. The bunk is arranged in the solution tank so that the tubulars are at an angle to horizontal to efficiently remove hydrogen gas. Solution flow to the header assembly is filtered to remove particulates.

Provided is a method of manufacturing a rotary machine, which includes: a casing forming process of forming a casing of the rotary machine that has multiple opening parts and suctions and discharges a fluid; a surface activating process of supplying a pretreatment liquid into the casing, then discharging the pretreatment liquid from the casing through the opening parts, and activating an inner surface of the casing after the casing forming process; a plating process of performing supply and discharge of a plating liquid into and from the easing through the opening parts to circulate the plating liquid and plating the inner surface of the casing after the surface activating process; and an assembling process of providing a rotating body that is rotatable relative to the casing so as to he covered from an outer circumference side by the casing plated in the plating process.

A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 μm to 1.5 μm; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 μm to 1.5 μm.

A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.

An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.