C23C18/22

Blister packages

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

Pretreatment of plastic surfaces for metallization to improve adhesion

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metallic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70 C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min.

Plating method

The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.

POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.

POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.

THERMOPLASTIC COMPOSITION WITH GOOD PLATING PERFORMANCE
20240043684 · 2024-02-08 ·

The present invention relates to a thermoplastic composition comprising (A) from 30 to 80 wt. % of aromatic polycarbonate, (B) from 10 to 35 wt. % of impact modifier, (C) from 10 to 35 wt. % of flow enhancing copolymer composition, (D) from 0 to 10 wt. % of further components wherein the combined weight of components (A), (B), (C) and (D) equals to 100 wt. % and the wt. % is based on the weight of the composition, the impact modifier comprises a copolymer of a conjugated diene elastomer wherein the amount of diene elastomer is at least 50 wt. %, based on the weight of the copolymer, the flow enhancing copolymer composition consists of (i) from 0 to 90 wt. % of first aromatic vinyl copolymer and (ii) from 100 to 10 wt. % of second aromatic vinyl copolymer having a Tg that is higher than the Tg of said first aromatic vinyl copolymer.

THERMOPLASTIC COMPOSITION WITH GOOD PLATING PERFORMANCE
20240043684 · 2024-02-08 ·

The present invention relates to a thermoplastic composition comprising (A) from 30 to 80 wt. % of aromatic polycarbonate, (B) from 10 to 35 wt. % of impact modifier, (C) from 10 to 35 wt. % of flow enhancing copolymer composition, (D) from 0 to 10 wt. % of further components wherein the combined weight of components (A), (B), (C) and (D) equals to 100 wt. % and the wt. % is based on the weight of the composition, the impact modifier comprises a copolymer of a conjugated diene elastomer wherein the amount of diene elastomer is at least 50 wt. %, based on the weight of the copolymer, the flow enhancing copolymer composition consists of (i) from 0 to 90 wt. % of first aromatic vinyl copolymer and (ii) from 100 to 10 wt. % of second aromatic vinyl copolymer having a Tg that is higher than the Tg of said first aromatic vinyl copolymer.

Partial plating method of automobile resin part and automobile resin part plated by using the same

A partial plating method of an automobile resin part may include a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied, and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on the entire surface of the automobile resin part except for the painting portion.

Partial plating method of automobile resin part and automobile resin part plated by using the same

A partial plating method of an automobile resin part may include a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied, and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on the entire surface of the automobile resin part except for the painting portion.

TOOL FOR PLATING RESIN MOLDED BODY AND METHOD FOR PLATING RESIN MOLDED BODY USING THE SAME

An object of the present invention is to provide a plating tool which avoids plating deposition on the tool itself in plating of a resin molded body, and therefore, also eliminates the need to exchange the plating tool. The object is achieved by a tool for plating a resin molded body, wherein a surface of a plating tool having an insulation coating part is coated with a plasticizer, and a method for plating a resin molded body using the tool.