It is provided a method for manufacturing a metal coated substrate by forming a metal coating on a surface of a substrate, comprising: immersing the substrate in a palladium/tin colloidal solution; immersing the substrate in an acid solution; carrying out electroless metal plating in order to obtain a continuous film-coated substrate, and subjecting the metal coating to a cryogenic treatment step in order to make it permeable to electromagnetic waves, the cryogenic treatment step being carried out by cooling the substrate with liquid nitrogen. It is also provided a metal coated substrate obtainable by the mentioned method and an article of manufacture made of the metal coated substrate.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): ##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): ##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

An electrode for a battery, comprising an active material and a metallic fabric is disclosed. The metallic fabric comprises fibers being at least partially covered by a coating of nickel or copper, which comprises a layer and a plurality of protrusions protruding from the layer. The active material is attached on the protrusions. The metallic fabric provides a high electrical conductivity and a high mechanical stability, and demonstrates outstanding performance for the use as a current collector of battery.

A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.

A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.

[Object]

To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.

[Solving Means]

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ.Math.cm or lower.

Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.