Patent classifications
C23F1/18
MANUFACTURING METHOD OF METAL COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS
This manufacturing method of a metal component enables precision processing of a corner portion, and the radius of curvature of a cog tip of a gear and the like can be made smaller than before. The manufacturing method of a metal component includes: (a) forming a mask film having, in plan view, a first side, a second side, and an extension portion that extends from a region between the first side and the second side on a metal film; and (b) forming a corner portion having, in plan view, a third side and a fourth side by etching the metal film.
Method of manufacturing transparent conductor, transparent conductor and device for manufacturing the same, and device for manufacturing transparent conductor precursor
According to one embodiment, a method of manufacturing a transparent conductor is provided. In the method, a silver nanowire layer including a plurality of silver nanowires and having openings is formed on a graphene film supported by a copper support. Then, a transparent resin layer insoluble in a copper-etching solution is formed on the silver nanowire layer such that the transparent resin layer contacts the graphene film through the openings. The copper support is then brought into contact with the non-acidic copper-etching solution to remove the copper support, thereby exposing the graphene film.
Method of manufacturing transparent conductor, transparent conductor and device for manufacturing the same, and device for manufacturing transparent conductor precursor
According to one embodiment, a method of manufacturing a transparent conductor is provided. In the method, a silver nanowire layer including a plurality of silver nanowires and having openings is formed on a graphene film supported by a copper support. Then, a transparent resin layer insoluble in a copper-etching solution is formed on the silver nanowire layer such that the transparent resin layer contacts the graphene film through the openings. The copper support is then brought into contact with the non-acidic copper-etching solution to remove the copper support, thereby exposing the graphene film.
Method of enhancing copper electroplating
Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
METHODS OF MODIFYING SURFACES OF DIAMOND PARTICLES, AND RELEATED DIAMOND PARTICLES AND EARTH-BORING TOOLS
A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.
Etching chelating agent, manufacturing method thereof, and etching solution composition
The invention discloses an etching chelating agent, a manufacturing method thereof, and an etching solution composition. The etching chelating agent includes cellulose cross-linked polymer, and the cellulose cross-linked polymer is obtained by cross-linking and polymerizing carboxymethyl cellulose and an amine compound.
Etching chelating agent, manufacturing method thereof, and etching solution composition
The invention discloses an etching chelating agent, a manufacturing method thereof, and an etching solution composition. The etching chelating agent includes cellulose cross-linked polymer, and the cellulose cross-linked polymer is obtained by cross-linking and polymerizing carboxymethyl cellulose and an amine compound.
Antibacterial surface treated copper material and a method for preparing the same
A manufacturing method of an antibacterial surface treated copper material includes: etching a metal base material including copper; primary heat-treating the metal base material; coating the metal base material with a composition for a coating; and secondary heat-treating the metal base material. The composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating.