An etching solution composition of this disclosure contains hydrogen peroxide, an etching inhibitor, a chelating agent, an etching additive, fluorides, a stabilizer, and water. Etching uniformity is increased by adjusting a mass proportion of each component in the etching solution composition, so as to avoid loss of properties such as etching tapered angles, etching deviation, and etching straightness, thereby enhancing product quality.

A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.

The present invention provides a process for selectively etching molybdenum or titanium relative to a oxide semiconductor film, including providing a substrate comprising a layer of oxide semiconductor and a layer comprising molybdenum or titanium on the layer of oxide semiconductor; preparing the substrate by applying a photoresist layer over the layer comprising molybdenum or titanium, and then patterning and developing the photoresist layer to form an exposed portion of the layer comprising molybdenum or titanium; providing a composition comprising ammonia or ammonium hydroxide, a quaternary ammonium hydroxide and a peroxide; and applying the composition to the exposed portion for a time sufficient to etch and remove the exposed portion of the layer comprising molybdenum or titanium, wherein the etching selectively removes the molybdenum or titanium relative to the oxide semiconductor.

The present invention provides a process for selectively etching molybdenum or titanium relative to a oxide semiconductor film, including providing a substrate comprising a layer of oxide semiconductor and a layer comprising molybdenum or titanium on the layer of oxide semiconductor; preparing the substrate by applying a photoresist layer over the layer comprising molybdenum or titanium, and then patterning and developing the photoresist layer to form an exposed portion of the layer comprising molybdenum or titanium; providing a composition comprising ammonia or ammonium hydroxide, a quaternary ammonium hydroxide and a peroxide; and applying the composition to the exposed portion for a time sufficient to etch and remove the exposed portion of the layer comprising molybdenum or titanium, wherein the etching selectively removes the molybdenum or titanium relative to the oxide semiconductor.

The present invention is concerned with a superhydrophobic surface arrangement, an article having the same and a method of making same. The arrangement is configured for generating, upon contact by water droplets, pancaking bouncing and reducing liquid contact time. The arrangement has an array of posts residing on a surface and extending from the surface, said posts having an elongate configuration with a base portion at one end and an upper portion at an opposite end. By way of the configuration of the posts and the Weber number the surface arrangement in use pancake bouncing of liquid droplets and reduction of contact time of the liquid droplets are effected.

A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.

The present invention provides a manufacture method of an array substrate and an array substrate manufactured by the method. By sequentially forming the first passivation layer and the flat layer, and then implementing patterning process and anneal process to the flat layer, in the anneal process to the flat layer, the flat layer and the source/the drain cannot contact with each other due to the first passivation layer inbetween, and thus, no reaction of generating complex happens, which is beneficial for promoting the electrical property of the array substrate and realizing the signal conduction; in comparison with prior art, the present invention can decrease at least one mask in advance, which is a advantage to raise the process result, to decrease the process time and to reduce the production cost. In the array substrate, the signal transmission is smooth, and the substrate possesses the great electrical property.

The present invention provides a manufacture method of an array substrate and an array substrate manufactured by the method. By sequentially forming the first passivation layer and the flat layer, and then implementing patterning process and anneal process to the flat layer, in the anneal process to the flat layer, the flat layer and the source/the drain cannot contact with each other due to the first passivation layer inbetween, and thus, no reaction of generating complex happens, which is beneficial for promoting the electrical property of the array substrate and realizing the signal conduction; in comparison with prior art, the present invention can decrease at least one mask in advance, which is a advantage to raise the process result, to decrease the process time and to reduce the production cost. In the array substrate, the signal transmission is smooth, and the substrate possesses the great electrical property.

The present disclosure relates to a removal composition for selectively removing an hard mask consisting essentially of TiN, TaN, TiNxOy, TiW, W, Ti and alloys of Ti and W relative to low-k dielectric material from a semiconductor substrate. The semiconductor substrate comprises a low-k dielectric material having a TiN, TaN, TiNxOy, TiW, W, Ti or alloy of Ti or W hard mask thereon. The removal composition comprises 0.1 wt % to 90 wt % of an oxidizing agent; 0.0001 wt % to 50 wt % of a carboxylate; and the balance up to 100 wt % of the removal composition comprising deionized water.

The present disclosure relates to a removal composition for selectively removing an hard mask consisting essentially of TiN, TaN, TiNxOy, TiW, W, Ti and alloys of Ti and W relative to low-k dielectric material from a semiconductor substrate. The semiconductor substrate comprises a low-k dielectric material having a TiN, TaN, TiNxOy, TiW, W, Ti or alloy of Ti or W hard mask thereon. The removal composition comprises 0.1 wt % to 90 wt % of an oxidizing agent; 0.0001 wt % to 50 wt % of a carboxylate; and the balance up to 100 wt % of the removal composition comprising deionized water.