Compositions and methods for etching a surface of an implantable device are disclosed. The compositions generally include one or more alkali components, such as a metal hydroxide and optionally an amine, one or more chelating agents, and certain dissolved metals, such as component metals of the metal or alloy to be etched and optionally iron. For example, when etching a titanium device, the metals may include titanium (Ti). Alternatively, the composition may be an electrolyte composition useful for electrochemical etching of the implantable device. These compositions and methods may generate nanoscale geometry on the surface of the implantable device to provide implants with accelerate osseointegration and healing after surgery.

The present invention provides a chemical liquid that causes a small variation in a dissolving amount of a first metal-containing substance in a case where the chemical liquid is applied to an object to be treated containing the first metal-containing substance. The present invention also provides a method for treating an object to be treated. The chemical liquid according to an embodiment of the present invention contains water, a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt, and a specific compound represented by Formula (1).

##STR00001##

The present invention provides a chemical liquid that causes a small variation in a dissolving amount of a first metal-containing substance in a case where the chemical liquid is applied to an object to be treated containing the first metal-containing substance. The present invention also provides a method for treating an object to be treated. The chemical liquid according to an embodiment of the present invention contains water, a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt, and a specific compound represented by Formula (1).

##STR00001##

The present invention provides a method for preparing an implant including preparing a mixed etching composition including hydrogen peroxide and a water-soluble carbonate compound and oxidatively etching an implant made of titanium or a titanium alloy by immersing the same in the etching composition; a titanium or titanium alloy implant prepared by oxidative etching with a mixed etching composition including hydrogen peroxide and a water-soluble carbonate compound; and a composition for treating surface of an implant containing hydrogen peroxide and a water-soluble carbonate compound. Further, the present invention relates to a titanium or titanium alloy implant which is prepared by oxidative etching with a mixed etching composition including hydrogen peroxide and a basic solution and on which surface bumps having continuous or discontinuous line-shaped open channel structures in nanoscale are irregularly formed, and a preparation method thereof. The surface of the titanium alloys treated with the mixed etching composition including hydrogen peroxide and a carbonate compound or the etching composition containing hydrogen peroxide and a basic solution of the present invention includes micrometer-sized bumps and channel-shaped nanometer-sized bumps, and thus has an increased surface area, and can not only improve wettability, but also effectively promote cell proliferation and osteocyte differentiation. In addition, the composition includes no chemical compounds such as a strong acid, etc. and is thus environmentally friendly, and such compounds can be prevented from remaining on the surface, which can improve biocompatibility, and therefore, the composition can be useful for implant surface treatment.

The present disclosure relates to the technical field of etching. More specifically, the present disclosure relates to an etching solution and an application thereof. A preparation raw material of the etching solution includes at least one oxidant, at least one stabilizer, and deionized water. Through the combined action of hydrogen peroxide and stabilizer, the etching solution of the present disclosure has the good stability, the longer service life, the faster etching rate and the better stability of the etching rate, and the etching solution of the present disclosure has a good etching effect on a titanium-series metal.

An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 Å/min.

An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 Å/min.

A biocompatible metal implant is provided with a treated surface subject to abrasive mechanical treatment, acid treatment, and sodium treatment, where the biocampatible metal implant treated surface has a macroporosity in the form of cells having dimensions of the order of 50 μm to 250 μm, the cells having pores of from 1 μm to 50 μm, and pores with a size of less than a micrometer, homogeneously over the whole of the treated surface, the treated surface having a surface roughness Ra of greater than or equal to 1.90 μm.

A biocompatible metal implant is provided with a treated surface subject to abrasive mechanical treatment, acid treatment, and sodium treatment, where the biocampatible metal implant treated surface has a macroporosity in the form of cells having dimensions of the order of 50 μm to 250 μm, the cells having pores of from 1 μm to 50 μm, and pores with a size of less than a micrometer, homogeneously over the whole of the treated surface, the treated surface having a surface roughness Ra of greater than or equal to 1.90 μm.

Pre-texturing agents, etchants, and photoresist stripping agents may be formulated to include one or more surfactants, from one or more surfactant classes, such as derivatives of amino acids that have surface-active properties.