Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof ##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof ##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

A method for sealing pores includes: providing an object which includes a substrate formed of a metal or alloy of the metal, and a passivation layer formed on the substrate, the passivation layer being formed of metal oxide and having a plurality of pores; immersing the object as a cathode and an anode in a solution containing metal cations and anions; providing an electric current between the anode and the object with an electric current density across the object being less than 0.5 A/dm.sup.2, such that the metal cations and anions in the solution undergo a redox reaction on the passivation layer; and sealing the pores of the passivation layer with a metallic compound formed by the redox reaction of the metal cations and the anions in the solution.

A method for sealing pores includes: providing an object which includes a substrate formed of a metal or alloy of the metal, and a passivation layer formed on the substrate, the passivation layer being formed of metal oxide and having a plurality of pores; immersing the object as a cathode and an anode in a solution containing metal cations and anions; providing an electric current between the anode and the object with an electric current density across the object being less than 0.5 A/dm.sup.2, such that the metal cations and anions in the solution undergo a redox reaction on the passivation layer; and sealing the pores of the passivation layer with a metallic compound formed by the redox reaction of the metal cations and the anions in the solution.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof

##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof

##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features.

Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features.