A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X.sup.1—CO—O—R.sup.11, X.sup.1—SO.sub.2—O—R.sup.11, X.sup.1—PO(OR.sup.11).sub.2, X.sup.1—SO—O—R.sup.11 functional groups, wherein X.sup.1 is a divalent group selected from (i) a chemical bond (ii) aryl, (iii) C.sub.1 to C.sub.12 alkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group —X.sup.11—X.sup.12—, (v) an alkylaryl group —X.sup.12—X.sup.11—, and (vi) —(O—C.sub.2H.sub.3R.sup.12).sub.mO—, R.sup.11 is selected from H and C.sub.1 to C.sub.4 alkyl. R.sup.12 is selected from H and C.sub.1 to C.sub.4 alkyl, X.sup.12 is a divalent aryl group, X.sup.11 is a divalent C.sub.1 to C.sub.15 alkandiyl group.

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof ##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof ##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof

##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof

##STR00001## wherein R.sub.1═C.sub.1-C.sub.18 hydrocarbon moiety comprising a SO.sub.3.sup.− group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R.sub.2═NR.sub.3R.sub.4 moiety, or OR.sub.5 moiety, or cyclic NR.sub.6 moiety, wherein R.sub.3, R.sub.4, R.sub.5=hydrogen, or C.sub.1-C.sub.18 aliphatic hydrocarbon moiety, or C.sub.1-C.sub.18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R.sub.3, R.sub.4 and R.sub.5 are identical or different; R.sub.6═C.sub.3-C.sub.8 hydrocarbon moiety, or C.sub.3-C.sub.8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.