Patent classifications
C03C3/093
Durable glass ceramic cover glass for electronic devices
The invention relates to glass articles suitable for use as electronic device housing/cover glass which comprise a glass ceramic material. Particularly, a cover glass comprising an ion-exchanged glass ceramic exhibiting the following attributes (1) optical transparency, as defined by greater than 90% transmission at 400-750 nm; (2) a fracture toughness of greater than 0.6 MPa.Math.m.sup.1/2; (3) a 4-point bend strength of greater than 350 MPa; (4) a Vickers hardness of at least 450 kgf/mm.sup.2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (5) a Young's Modulus ranging between about 50 to 100 GPa; (6) a thermal conductivity of less than 2.0 W/m° C., and (7) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
GLASS FILLER AND METHOD FOR PRODUCING THE SAME, AND RESIN-CONTAINING COMPOSITION INCLUDING GLASS FILLER
Provided is a novel glass filler having a low permittivity. The glass filler provided includes a glass composition, wherein the glass composition includes, in wt %:95≤SiO.sub.2≤99.5; 0≤B.sub.2O.sub.3≤2; 0.01≤Al.sub.2O.sub.3≤4; 0≤R.sub.2O≤4; 0.01≤RO ≤4; and 0≤TiO.sub.2≤4, where RO is at least one selected from MgO, CaO, SrO, and ZnO, and R.sub.2O is at least one selected from Li.sub.2O, Na.sub.2O, and K.sub.2O. This glass filler can have a permittivity of less than 4 at 1 GHz.
GLASS FILLER AND METHOD FOR PRODUCING THE SAME, AND RESIN-CONTAINING COMPOSITION INCLUDING GLASS FILLER
Provided is a novel glass filler having a low permittivity. The glass filler provided includes a glass composition, wherein the glass composition includes, in wt %:95≤SiO.sub.2≤99.5; 0≤B.sub.2O.sub.3≤2; 0.01≤Al.sub.2O.sub.3≤4; 0≤R.sub.2O≤4; 0.01≤RO ≤4; and 0≤TiO.sub.2≤4, where RO is at least one selected from MgO, CaO, SrO, and ZnO, and R.sub.2O is at least one selected from Li.sub.2O, Na.sub.2O, and K.sub.2O. This glass filler can have a permittivity of less than 4 at 1 GHz.
GLASS, STRENGTHENED GLASS, AND METHOD FOR MANUFACTURING STRENGTHENED GLASS
A glass of the present invention includes as a glass composition, in terms of mass %, 50% to 75% of SiO.sub.2, 1% to 30% of Al.sub.2O.sub.3, 0% to 25% of B.sub.2O.sub.3, 0% to 10% of Li.sub.2O, 0.01% to 20% of Na.sub.2O, 0% to 10% of K.sub.2O, 0.0001% to 0.1% of Fe.sub.2O.sub.3, 0.00001% to 0.01% of Cr, 0.00001% to 0.01% of Ni, and 0.0001% to 0.5% of TiO.sub.2.
Colored glass articles having improved mechanical durability
A colored glass article includes greater than or equal to 50 mol % and less than or equal to 80 mol % SiO.sub.2; greater than or equal to 7 mol % and less than or equal to 25 mol % Al.sub.2O.sub.3; greater than or equal to 1 mol % and less than or equal to 15 mol % B.sub.2O.sub.3; greater than or equal to 5 mol % and less than or equal to 20 mol % Li.sub.2O; greater than or equal to 0.5 mol % and less than or equal to 15 mol % Na.sub.2O; greater than 0 mol % and less than or equal to 1 mol % K.sub.2O; and greater than or equal to 1×10.sup.−6 mol % and less than or equal to 1 mol % Au. R.sub.2O—Al.sub.2O.sub.3 is greater than or equal to −5 mol % and less than or equal to 7 mol %, R.sub.2O being the sum of Li.sub.2O, Na.sub.2O, and K.sub.2O.
Colored glass articles having improved mechanical durability
A colored glass article includes greater than or equal to 50 mol % and less than or equal to 80 mol % SiO.sub.2; greater than or equal to 7 mol % and less than or equal to 25 mol % Al.sub.2O.sub.3; greater than or equal to 1 mol % and less than or equal to 15 mol % B.sub.2O.sub.3; greater than or equal to 5 mol % and less than or equal to 20 mol % Li.sub.2O; greater than or equal to 0.5 mol % and less than or equal to 15 mol % Na.sub.2O; greater than 0 mol % and less than or equal to 1 mol % K.sub.2O; and greater than or equal to 1×10.sup.−6 mol % and less than or equal to 1 mol % Au. R.sub.2O—Al.sub.2O.sub.3 is greater than or equal to −5 mol % and less than or equal to 7 mol %, R.sub.2O being the sum of Li.sub.2O, Na.sub.2O, and K.sub.2O.
Optical glass and optical component
An optical glass has a refractive index (n.sub.d) of 1.64 or more. A P value represented by the following formula (1) is in a range of 7.0<P value<10.0: P value=log(A.sub.450×P.sub.450+A.sub.550×P.sub.550+A.sub.650×P.sub.650+A.sub.750×P.sub.750) (1). A.sub.450, A.sub.550, A.sub.650 and A.sub.750 are absorbances of the optical glass with a plate thickness of 10 mm at a wavelength of 450 nm, 550 nm, 650 nm and 750 nm, respectively. P.sub.450, P.sub.550, P.sub.650 and P.sub.750 are radiances of light having a wavelength of 450 nm, 550 nm, 650 nm and 750 nm, respectively, at 1,300° C. according to Planck's radiation law. All of internal transmittances in terms of a 10-mm thickness at wavelengths of 450 nm, 550 nm, 650 nm and 750 nm are 91% or more.
GLASS AND MELT SOLDER FOR THE PASSIVATION OF SEMICONDUCTOR COMPONENTS
The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
GLASS AND MELT SOLDER FOR THE PASSIVATION OF SEMICONDUCTOR COMPONENTS
The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
Articles with patterned coatings
Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.