Patent classifications
C04B35/47
Manufacturing method of dielectric ceramic composition and dielectric ceramic composition manufactured by the same
A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.
Dielectric film, dielectric element, and electronic circuit board
A dielectric film includes a main component of a complex oxide represented by a general formula of (Sr.sub.1-xCa.sub.x).sub.yTiO.sub.3. 0.40≤x≤0.90 and 0.90≤y≤1.10 are satisfied. A ratio of a diffraction peak intensity on (1, 1, 2) plane of the complex oxide to a diffraction peak intensity on (0, 0, 4) plane of the complex oxide in an X-ray diffraction chart of the dielectric film is 3.00 or more. Instead, a ratio of an intensity of a diffraction peak appearing at a diffraction angle 2θ of 32° or more and 34° or less to an intensity of a diffraction peak appearing at a diffraction angle 2θ of 46° or more and 48° or less in an X-ray diffraction chart of the dielectric film obtained by an X-ray diffraction measurement with Cu-Kα ray as an X-ray source is 3.00 or more.
MULTILAYER CERAMIC CAPACITOR
A multilayer ceramic capacitor include: a ceramic body including first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces; a plurality of internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, the plurality internal electrodes each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on sides of the internal electrodes exposed to the first and second surfaces. A dielectric composition of the first and second side margin portions is different from a dielectric composition of the ceramic body, and a dielectric constant of the first and second side margin portions is lower than a dielectric constant of the ceramic body.
CERAMIC COMPOSITE OXIDE
The invention provides a ceramic composite oxide of formula (I): (1−x)AaBbOy+xCcDdOz (I) wherein A, B, C and D are each independently selected from the group consisting of Li, Na, Mg, Al, P, K, Ca, Sc, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Ru, In, Sn, Ba, La, Ce, Pr, Nd, Sm, Eu, Gd, Er, Tm, Yb, Lu, Ta, W, Bi and mixtures thereof; x is 0.05 to 0.95; y and z are balanced by the charge of the cations; 0≤a, b, c, d≤1; and wherein said ceramic composite oxide has an average particle size diameter of 10 to 700 nm.
CERAMIC COMPOSITE OXIDE
The invention provides a ceramic composite oxide of formula (I): (1−x)AaBbOy+xCcDdOz (I) wherein A, B, C and D are each independently selected from the group consisting of Li, Na, Mg, Al, P, K, Ca, Sc, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Ru, In, Sn, Ba, La, Ce, Pr, Nd, Sm, Eu, Gd, Er, Tm, Yb, Lu, Ta, W, Bi and mixtures thereof; x is 0.05 to 0.95; y and z are balanced by the charge of the cations; 0≤a, b, c, d≤1; and wherein said ceramic composite oxide has an average particle size diameter of 10 to 700 nm.
Barium strontium titanate-based dielectric ceramic materials, preparation method and application thereof
The present application relates to a barium strontium titanate-based dielectric ceramic material, a preparation method, and application thereof. The composition of the barium strontium titanate-based dielectric ceramic material comprises: aBaTiO3+bSrTiO3+cTiO2+dBi.sub.2O.sub.3+eMgO+fAl2O3+gCaO+hSiO2, wherein a, b, c, d, e, f, g, and h are the molar percentage of each component, 20≤a≤50 mol %, 15≤b≤30 mol %, 10≤c≤20 mol %, 0≤d≤10 mol %, 0≤e≤35 mol %, 0≤f≤6 mol %, 0≤g≤6 mol %, 0≤h≤1 mol %, and a+b+c+d+e+f+g+h=100 mol %.
Barium strontium titanate-based dielectric ceramic materials, preparation method and application thereof
The present application relates to a barium strontium titanate-based dielectric ceramic material, a preparation method, and application thereof. The composition of the barium strontium titanate-based dielectric ceramic material comprises: aBaTiO3+bSrTiO3+cTiO2+dBi.sub.2O.sub.3+eMgO+fAl2O3+gCaO+hSiO2, wherein a, b, c, d, e, f, g, and h are the molar percentage of each component, 20≤a≤50 mol %, 15≤b≤30 mol %, 10≤c≤20 mol %, 0≤d≤10 mol %, 0≤e≤35 mol %, 0≤f≤6 mol %, 0≤g≤6 mol %, 0≤h≤1 mol %, and a+b+c+d+e+f+g+h=100 mol %.
Composite structure, fired body having composite structure, powder including particle having composite structure, and dielectric element including dielectric having composite structure
A composite structure including a conductor region that is configured from a first oxide, and an insulator region that is configured from a second oxide and that surrounds the conductor region, wherein the first oxide and the second oxide are in hetero structure with each other. A powder and a fired body each having such a composite structure are also preferable.
Composite structure, fired body having composite structure, powder including particle having composite structure, and dielectric element including dielectric having composite structure
A composite structure including a conductor region that is configured from a first oxide, and an insulator region that is configured from a second oxide and that surrounds the conductor region, wherein the first oxide and the second oxide are in hetero structure with each other. A powder and a fired body each having such a composite structure are also preferable.
PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.