Patent classifications
C04B2235/3258
Dielectric Ceramic Composition and Ceramic Capacitor Using the Same
The present invention discloses a dielectric ceramic formula enabling one to obtain a multilayer ceramic capacitor by alternatively stacking the ceramic dielectric layers and base metal internal electrodes. The dielectric ceramic composition comprises a primary ingredient:
[(Na.sub.1-xK.sub.x).sub.sA.sub.1-s].sub.m[(Nb.sub.1-yTa.sub.y).sub.uB1.sub.vB2.sub.w)]O.sub.3
wherein:
A is at least one selected from the alkaline-earth element group of Mg, Ca, Sr, and Ba;
B1 is at least one selected from the group of Ti, Zr, Hf and Sn;
B2 is at least one selected from transition metal elements;
and wherein:
x, y, s, u, v, and w are molar fractions of respective elements, and m is the molar ratio of [(Na.sub.1-xK.sub.x).sub.sA.sub.1-s] and [(Nb.sub.1-yTa.sub.y).sub.uB1.sub.vB2.sub.w)]. They are in the following respective range:
0.93≤m≤1.07;
0.7≤s≤1.0;
0.00≤x≤0.05; 0.00≤y≤0.65;
0.7≤u≤1.0; 0.0≤v≤0.3; 0.001≤w≤0.100;
a first sub-component composes of at least one selected from the rare-earth compound,
wherein the rare-earth element is no more than 10 mol % parts with respect to the main component; and
a second sub-component composes a compound with low melting temperature to assist the ceramic sintering process, said frit, which is Li free and could be at least one selected from fluorides, silicates, borides, and oxides. The content of frit is within the range of 0.01 mol % to 15.00 mol % parts with respect to the main component.
Dielectric Ceramic Composition and Multi-Layered Ceramic Capacitor Comprised Thereof
This invention relates to a multilayer ceramic capacitor produced by alternatively stacking the ceramic dielectric layers and internal electrodes mainly comprise base metals. The present dielectric ceramic composition having a main component with a perovskite structure ABO.sub.3 formula of:
(K.sub.xNa.sub.yLi.sub.zA.sub.1-x-y-z).sub.m(Nb.sub.uTa.sub.vB.sub.w)O.sub.3
wherein:
A is at least one selected from the alkaline earth element group of Ca, Sr, and Ba;
B is at least one selected from the group of Ti, Zr, Hf and Sn;
and wherein:
x, y, z, u, v, and w are molar fractions of respective elements, and m is the molar ratio of A-site and B-site elements. They are in the following respective range:
0.95≤m≤1.05;
0.05≤x≤0.90; 0.05≤y≤0.90; 0.00≤z≤0.12
0<u<1; 0.0≤w≤0.3; u+v+w=1
The dielectric ceramic composition further contains:
a first accessory ingredient composes at least one selected from the rare-earth compounds, wherein the rare-earth element is no more than 10 mole parts with respect to 100 mole parts of the main component; a second accessory ingredient composes at least one selected from transition metal compounds, wherein the transition metal element is in the range of 0.05 mole to 10.00 mole parts with respect to 100 mole parts of the main component; and a third accessory ingredient composes a compound with low melting temperature to assist the ceramic sintering process, which is within the range of 0.01 mole to 15 mole parts with respect to 100 mole parts of the main component.
Ceramic material and method of preparing the same
A ceramic material, including: BaWO.sub.4-xM.sub.2CO.sub.3-yBaO-zB.sub.2O.sub.3-wSiO.sup.2, where x=0-0.2 mole, y=0-0.05 mole, z=0-0.2 mole, w=0-0.1 mole, M represents an alkali metal ion selected from Li.sup.+, K.sup.+, Na.sup.+, and x, y, z, and w are not zero at the same time.
CUBIC BORON NITRIDE SINTERED MATERIAL
A cubic boron nitride sintered material includes: 20 to 80 volume % of cBN grains; and 20 to 80 volume % of a binder phase, wherein the binder phase includes first binder grains and second binder grains, in each of the first binder grains, a ratio of the number of atoms of the first metal element to a total of the number of atoms of the titanium and the first metal element is more than or equal to 0.01% and less than 10%, in each of the second binder grains, the ratio is more than or equal to 10% and less than or equal to 80%, and an average grain size of the second binder grains is more than or equal to 0.2 μm and less than or equal to 1 μm.
CUBIC BORON NITRIDE SINTERED MATERIAL
A cubic boron nitride sintered material includes: 20 to 80 volume % of cBN grains; and 20 to 80 volume % of a binder phase, wherein the binder phase includes first binder grains and second binder grains, in each of the first binder grains, a ratio of the number of atoms of the first metal element to a total of the number of atoms of the titanium and the number of atoms of the first metal element is more than or equal to 0.01% and less than 10%, in each of the second binder grains, this ratio is more than or equal to 10% and less than or equal to 80%, and in an X-ray diffraction spectrum of the cubic boron nitride sintered material, one or both of conditions 1 and 2 are satisfied.
Oriented apatite type oxide ion conductor and method for producing same
An oriented apatite-type oxide ion conductor includes a composite oxide expressed as A.sub.9.33+x[T.sub.6.00−yM.sub.y]O.sub.26.0+z, where A represents one or two or more elements selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Be, Mg, Ca, Sr, and Ba, T represents an element including Si or Ge or both, and M represents one or two or more elements selected from the group consisting of B, Ge, Zn, Sn, W, and Mo, and where x is from −1.00 to 1.00, y is from 0.40 to less than 1.00, and z is from −3.00 to 2.00.
Dielectric material, method of manufacturing thereof, and dielectric devices and electronic devices including the same
A dielectric material, a method of manufacturing thereof, and a dielectric device and an electronic device including the same. A dielectric material includes a layered metal oxide including a first layer having a positive charge and a second layer having a negative charge which are laminated, a monolayer nanosheet exfoliated from the layered metal oxide, a nanosheet laminate of the monolayer nanosheets, or a combination thereof, wherein the dielectric material includes a two-dimensional layered material having a two-dimensional crystal structure and the two-dimensional layered material is represented by Chemical Formula 1.
Functional high-performance fiber structure
A method is provided for growing a fiber structure, where the method includes: obtaining a substrate, growing an array of pedestal fibers on the substrate, growing fibers on the pedestal fibers, and depositing a coating surrounding each of the fibers. In another aspect, a method of fabricating a fiber structure includes obtaining a substrate and growing a plurality of fibers on the substrate according to 1½D printing. In another aspect, a multilayer functional fiber is provided produced by, for instance, the above-noted methods.
Garnet materials for Li secondary batteries and methods of making and using garnet materials
Set forth herein are garnet material compositions, e.g., lithium-stuffed garnets and lithium-stuffed garnets doped with alumina, which are suitable for use as electrolytes and catholytes in solid state battery applications. Also set forth herein are lithium-stuffed garnet thin films having fine grains therein. Disclosed herein are novel and inventive methods of making and using lithium-stuffed garnets as catholytes, electrolytes and/or anolytes for all solid state lithium rechargeable batteries. Also disclosed herein are novel electrochemical devices which incorporate these garnet catholytes, electrolytes and/or anolytes. Also set forth herein are methods for preparing novel structures, including dense thin (<50 um) free standing membranes of an ionically conducting material for use as a catholyte, electrolyte, and, or, anolyte, in an electrochemical device, a battery component (positive or negative electrode materials), or a complete solid state electrochemical energy storage device. Also, the methods set forth herein disclose novel sintering techniques, e.g., for heating and/or field assisted (FAST) sintering, for solid state energy storage devices and the components thereof.
DENSE TARGET
A sputtering target includes at least one single piece with a length of at least 600 mm. The sputtering target has a backing structure provided with target material for sputtering. At least 40% of the mass of the target material includes a so-called target volatile material which shows, at pressures between 700 hPa and 1300 hPa, either a sublimation temperature, or decomposition temperature below its melting point or a melting temperature and an absolute boiling temperature being close to each other. The sputtering target has a target material density of at least 95% of the theoretical density of the target material. The sputtering target includes a bonding layer with a thickness of 0 to 500 μm between the backing structure and the target material.