Patent classifications
C04B2237/346
Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.
Method of producing a multi-layer ceramic electronic component and multi-layer ceramic electronic component
A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.
Method of manufacturing multilayer ceramic capacitor
A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.
MULTILAYER ELECTRONIC COMPONENT HAVING MOISTURE-PROOF LAYER ON BODY THEREOF
A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of any one of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.
MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF
Provided is a multilayer ceramic capacitor having dielectric layers and internal electrode layers laminated alternately on one another. Each internal electrode layer comprises a common ceramic material containing 3 to 25% by weight of rare earth elements, and through the rare earth elements, high dielectric layers are formed on the interfaces between the dielectric layers and the internal electrode layers.
CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.
Manufacturing method of ceramic powder
A manufacturing method of ceramic powder includes: synthesizing barium titanate powder from barium carbonate, titanium dioxide, manganese carbonate, and one of ammonium molybdate and tungsten oxide, wherein: a solid solution amount of the donor element is 0.05 mol or more and 0.3 mol or less; a solid solution amount of the accepter element with respect to the barium titanate is 0.02 mol or more and 0.2 mol or less on a presumption that the amount of the barium titanate is 100 mol and the acceptor element is converted into an oxide; and relationships y≥−0.0003x+1.0106, y≤−0.0002x+1.0114, 4≤x≤25 and y≤1.0099 are satisfied when a specific surface area of the ceramic powder is “x” and an axial ratio c/a of the ceramic powder is “y”.
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO.sub.3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.
DIELECTRIC SUBSTANCE, ELECTRONIC DEVICE AND MULTILAYER CERAMIC CAPACITOR
A dielectric substance includes a core-shell grain having a twin crystal structure. An interface of the twin crystal structure of the core-shell grain extends from a shell on one side, passes through a core, and extends to the shell on the other side.
CERAMIC COMPONENT AND METHOD FOR PRODUCING THE CERAMIC COMPONENT
A ceramic component having a ceramic main part containing AxByC1−x−vTi1—y+wO3* (Mn2P2O7)z*Du, in which A is a first dopant selected from a group including neodymium, praseodymium, cerium, and lanthanum, B is a second dopant selected from a group including niobium, tantalum, and vanadium, C is selected from a group including calcium, strontium, and barium, and D includes a metal selected from a group including aluminum, nickel, and iron. x is the proportion of A, y is the proportion of B, v is the proportion of A vacancies, w is the proportion of excess titanium, z is the proportion of Mn2P2O7, u is the proportion of D, and the following applies: 0.0≤x≤0.1, 0.0≤y<0.1, 0≤v<1.5*x, 0≤w<0.05, 0.01≤z<0.1, 0≤u<0.05. A method for producing the ceramic component is also disclosed.