A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

The invention relates to a method for the preparation of a blank from a ceramic material, wherein at least two layers of ceramic material of different compositions are filled into a die layer-by-layer and after filling of the layers they are then pressed and sintered, wherein after filling of a first layer this is structured on its surface in such a way that the first layer, viewed across its surface, differs in its height from region to region, and then a layer with a composition that differs from the first layer is filled as a second layer into the mold.

In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).

A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.

The disclosure relates to a bond produced with an at least partially crystallized glass, such as a metal-to-glass bond, in particular a metal-to-glass bond in a feed-through element or connecting element, and to a method for producing such a bond, in particular in a feed-through element or connecting element. The at least partially crystallized glass includes at least one crystal phase and pores which are distributed in the at least partially crystallized glass in a structured manner.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

A multilayer piezoelectric element using an alkaline niobate-based piezoelectric ceramic, which can inhibit its reliability from dropping while lowering production cost, is characterized by forming internal electrodes (10) with a metal whose silver content is 80 percent by mass or higher, and also constituting piezoelectric ceramic layers (40) with a piezoelectric ceramic whose primary component is an alkaline niobate having a perovskite structure and which also contains a lithium manganate.

A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

A non-dense sintered ceramic molded body having at least two layers, wherein a first powdery ceramic material forming a layer is contacted with at least a second powdery material forming at least a second layer. The body has a color gradient and maintains dimensional stability during sintering and forming. An admixing component and a common sintering temperature are used to control the volume decrease of the layers during sintering.