A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.

The electrolyte membrane of the present disclosure includes a plurality of crystal domains. At least one of the crystal domains includes a first crystal subdomain and a second crystal subdomain. Each of the first crystal subdomain and the second crystal subdomain includes Ba, Zr, M, and O. M is a trivalent element. The concentration of M in the first crystal subdomain is different from the concentration of M in the second crystal subdomain.

The present invention is a thermoplastic polymer composition which contains 10-120 parts by mass of a polar group-containing polypropylene resin (B) per 100 parts by mass of a thermoplastic elastomer (A) that is a block copolymer having a polymer block containing an aromatic vinyl compound unit and a polymer block composed of a conjugated diene unit having 40% by mole or more of 1,2-bonds and 3,4-bonds in total, or a hydrogenated product of the block copolymer (provided that a thermoplastic polymer composition containing 1 part by mass or more of a polyvinyl acetal resin is excluded). This thermoplastic polymer composition is able to be bonded with a ceramic, a metal or a synthetic resin without requiring a primer treatment, and has excellent flexibility, mechanical characteristics, moldability, heat resistance and storage stability.

A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

A method for producing a ceramic multilayer element is disclosed. In an embodiment the method includes forming a plurality of multilayer segments in a green state, wherein each multilayer segment is formed by pressing together a plurality of ceramic layers in the green state and pressing together the multilayer segments in the green state to form a multilayer element that is in the green state. The method further includes sintering the multilayer element that is in the green state to form a ceramic multilayer element that includes the ceramic layers and electrode layers arranged one on top of another, wherein at least one or more of a temperature at which the multilayer segments are pressed together, a pressing force applied during the pressing of the multilayer segments, and/or a duration of the pressing of the multilayer segments are adjusted.

A method is described. The method is a method for making a constraining ceramic assembly. The method includes applying at least one metallic electrode to a substrate. The method also includes applying a porous ceramic layer to the substrate to cover the metallic electrode. The method also includes sintering the substrate, the porous ceramic layer, and the metallic electrode together at a sintering temperature above a melting point of the metallic electrode.

An adapter element (10) for connecting an electronic component (30) to a heat sink element (20), including an insulation layer (15) extending along a main extension plane (HSE), and at least a first web element (11) and a second web element (12), which are arranged next to each other in a direction parallel to the main extension plane (HSE), forming a free area (13), which, in the assembled state, are arranged between the insulating layer (15) and the electronic component (30) in a direction running perpendicular to the main extension plane (HSE), and on whose front sides (18) facing away from the insulating layer (15) the electronic component (30) is arranged in the assembled state, wherein a distance (A) between the first web element (11) and the second web element (12), measured in a plane parallel to the main extension plane (HSE), is smaller than 350 μm.

A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a constituent layer formation step of forming a constituent layer which corresponds to a constituent region of the three-dimensional shaped article, a support layer formation step of forming a support layer which is in contact with the constituent layer and supports the constituent layer, and a sintering step of sintering the constituent layer, wherein the support layer is configured such that as compared with the volume decrement accompanying the sintering step of a space surrounded by the constituent layer from at least two directions, the volume decrement accompanying the sintering step of the support layer which supports the constituent layer in the space is larger.

A ceramic substrate for an electrochemical element that includes a ceramic layer and a high-thermal-expansion-coefficient material layer that is laminated on the surface of the ceramic layer. The high-thermal-expansion-coefficient material layer has a higher coefficient of thermal expansion than the ceramic layer, and applies compressive stress to the ceramic layer.

The invention relates to a ceramic molded article (1) that has recesses (2) and comprises at least two plates (joined parts) (3) made of a ceramic material, i.e. a lower base plate (9), an upper cover plate (8) and, optionally, one or more intermediate plates (7) which are stacked on top of each other and are joined to each other on the surfaces thereof to form the molded article (1); a joining material (paste) is placed between the plates (joined parts) (3).