Provided are a tricyclodecane dimethanol composition which may be suitably used in preparing a polyester resin exhibiting excellent solvent resistance and chemical resistance when forming a coating film and having excellent solubility in organic solvents or water, and a preparation method thereof.

A hydrocarbon production method for producing hydrocarbons from a hydrocarbon mixture includes: a first extractive distillation step of performing extractive distillation of an extractive distillation target to obtain a fraction (A) in which isoprene and piperylene are enriched and a fraction (B) in which a linear hydrocarbon and a branched hydrocarbon are enriched; a first distillation step of obtaining a fraction (C) in which isoprene is enriched and a fraction (D) in which piperylene is enriched from the fraction (A); a dehydrogenation step of performing dehydrogenation or oxidative dehydrogenation of either or both of the linear hydrocarbon and the branched hydrocarbon contained in the fraction (B) to obtain a dehydrogenated product; and a recovery step of supplying the dehydrogenated product to an extractive distillation column or a distillation column and obtaining isoprene and/or piperylene from the dehydrogenated product.

The invention discloses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers containing dicyclopentadiene, a method of producing the same and use thereof. The cured products of the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention exhibit low dielectric constant, low dissipation, and high glass transition temperature. As the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention have number-average molecular weight ranging from 2500 to 6000 g/mol, the substrate made of theses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers can pass the pressure cook test. Besides, the low dissipation factor characteristic the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention can only be demonstrated at number-average molecular weight higher than 2500 g/mol.

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (CSPs), ball grid arrays (BGAs), land grid arrays (LGAs) and the like (collectively, subcomponents), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Provided are a tricyclodecane dimethanol composition, in which a ratio of structural isomers is controlled, and a preparation method thereof.

A system and a process for dimerizing cyclopentadiene (CPD) including producing a C.sub.6+C.sub.7 rich bottoms stream and a C.sub.5 rich side draw from a debutanizer, where the C.sub.5 rich side draw and at least a portion of the C.sub.6+C.sub.7 rich bottoms stream are directed to a dimerizer where the CPD is thermally dimerized to dicyclopentadiene (DCPD). DCPD is more stable than CPD and thus safer to handle.

High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

The invention relates to a compound of the general formula (I) N.sub.3O.sub.2SAr-L-ArSO.sub.2N.sub.3, wherein: Ar and Ar are aromatic building blocks; and L is a linking group comprising at least one heteroatom as well as an organic chain denoted as Sp and having at least two carbon atoms. The invention also relates to a compound of the general formula (II) wherein: Ar and Ar are aromatic building blocks; L is a covalent bond or a linking group; m and n are both 0 or 1, at least one of m and n being 1; Sp and Sp are organic chains having at least two carbon atoms. The invention also relates to the use of these compounds as cross linking agents in the manufacture of polymers.

A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.