C08F20/18

Liquid crystal composition

A liquid crystal composition is provided containing a first liquid crystal compound represented by formula (1): ##STR00001##
and a second liquid crystal compound represented by formula (2): ##STR00002## Also provided is a method for producing the liquid crystal composition having a desired wavelength dispersion characteristic.

Liquid crystal composition

A liquid crystal composition is provided containing a first liquid crystal compound represented by formula (1): ##STR00001##
and a second liquid crystal compound represented by formula (2): ##STR00002## Also provided is a method for producing the liquid crystal composition having a desired wavelength dispersion characteristic.

(Meth)acrylic oligomers

The invention provides (meth)acrylic oligomers prepared from C1-C20 alkyl and C5-C20 cycloalkyl (meth)acrylates, wherein said oligomers have a Mn of about 300 g/mole to about 3,000 g/mole; a Mw of about 700 g/mole to about 6,000 g/mole; a Mz of about 900 g/mole to about 10,000 g/mole. The oligomers may have a Yellowness Index, according to ASTM E313 of less than 2. The oligomers of the invention are useful as tackifiers in adhesive compositions, but also are believed to be useful also in general polymer modification as plasticizers, leveling agents, viscosity reducers (i.e., rheology modifiers), and for increasing solids content in solvent-borne applications of all types with little detrimental impact on viscosity. The invention also provides adhesive compositions and laminate articles coated on at least one side with the adhesive compositions of the invention.

(Meth)acrylic oligomers

The invention provides (meth)acrylic oligomers prepared from C1-C20 alkyl and C5-C20 cycloalkyl (meth)acrylates, wherein said oligomers have a Mn of about 300 g/mole to about 3,000 g/mole; a Mw of about 700 g/mole to about 6,000 g/mole; a Mz of about 900 g/mole to about 10,000 g/mole. The oligomers may have a Yellowness Index, according to ASTM E313 of less than 2. The oligomers of the invention are useful as tackifiers in adhesive compositions, but also are believed to be useful also in general polymer modification as plasticizers, leveling agents, viscosity reducers (i.e., rheology modifiers), and for increasing solids content in solvent-borne applications of all types with little detrimental impact on viscosity. The invention also provides adhesive compositions and laminate articles coated on at least one side with the adhesive compositions of the invention.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20230091645 · 2023-03-23 ·

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

Resin composition and article made therefrom

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURING ANTIVIRAL SUBSTRATE, ANTIMICROBIAL SUBSTRATE, ANTIMICROBIAL COMPOSITION AND METHOD FOR MANUFACTURING ANTIMICROBIAL SUBSTRATE

In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder.

Photopolymerisable composition, material obtained by polymerising such a composition and 3D printing method using such a composition

A photopolymerizable composition comprises at least a polymerizable resin, a photosensitizer, an annihilator, and a photoinitiator. The photosensitizer is formulated to absorb an excitation light signal received in a first range of wavelengths. The annihilator is formulated to emit a light signal in a second range of wavelengths different from the first. During the absorption of light by the photosensitizer in the first range of wavelengths, the annihilator emits a light signal in the second range, a photon energy of the emitted light signal being greater than a photon energy of the light signal received by the photosensitizer. The annihilator is also formulated to implement an energy transfer mechanism to excite the photoinitiator for polymerization of the resin. The excited photoinitiator is formulated to generate at least one polymerizable initiator to cause the polymerization reaction. Related methods, such as three-dimensional printing methods, and materials are also disclosed.

ANAEROBICALLY CURABLE COMPOSITIONS

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

ANAEROBICALLY CURABLE COMPOSITIONS

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.