Patent classifications
C08F220/282
Light curable composition
This invention relates to a light curable composition, comprising at least one acrylate monomer, at least one acrylamide compound, at least one acrylate oligomer, and at least one photoinitiator. The light curable composition of the present invention exhibits excellent elongation property after curing and is suitable to be applied for 3D printing.
Light curable composition
This invention relates to a light curable composition, comprising at least one acrylate monomer, at least one acrylamide compound, at least one acrylate oligomer, and at least one photoinitiator. The light curable composition of the present invention exhibits excellent elongation property after curing and is suitable to be applied for 3D printing.
ELASTIC MATERIALS PREPARED FROM CURABLE LIQUID COMPOSITIONS
The invention relates to an elastic material having high rebound resilience, which is an energy-cured material obtained from a composition comprising a specific urethane (meth)acrylate comprising oxybutylene units.
ELASTIC MATERIALS PREPARED FROM CURABLE LIQUID COMPOSITIONS
The invention relates to an elastic material having high rebound resilience, which is an energy-cured material obtained from a composition comprising a specific urethane (meth)acrylate comprising oxybutylene units.
PHOTOSENSITIVE RESIN COMPOSITION, MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN, AND METHOD FOR PRODUCING MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN
Disclosed is a photosensitive resin composition containing a polymerizable component and used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern. The polymerizable component contains an organic sulfur compound. A viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa.Math.s.
PHOTOSENSITIVE RESIN COMPOSITION, MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN, AND METHOD FOR PRODUCING MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN
Disclosed is a photosensitive resin composition containing a polymerizable component and used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern. The polymerizable component contains an organic sulfur compound. A viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa.Math.s.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) of which polarity increases by an action of an acid, the resin (A) having a repeating unit represented by General Formula (A1) as defined herein; and a compound (B) that generates an acid upon irradiation with actinic rays or radiation.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) of which polarity increases by an action of an acid, the resin (A) having a repeating unit represented by General Formula (A1) as defined herein; and a compound (B) that generates an acid upon irradiation with actinic rays or radiation.
CROSSLINKERS AND CURABLE COMPOSITIONS INCLUDING THE SAME
Provided are novel crosslinkers and curable compositions including such crosslinkers. Bonded constructions including the disclosed curable compositions display high adhesion, elongation, and impact resistance even if the bonded substrate receives no surface treatment prior to bonding. Provided are elastomeric products including the curable compositions, methods of making the same, and uses thereof.
CROSSLINKERS AND CURABLE COMPOSITIONS INCLUDING THE SAME
Provided are novel crosslinkers and curable compositions including such crosslinkers. Bonded constructions including the disclosed curable compositions display high adhesion, elongation, and impact resistance even if the bonded substrate receives no surface treatment prior to bonding. Provided are elastomeric products including the curable compositions, methods of making the same, and uses thereof.