There is provided a maintenance liquid, which is used in maintenance of a device equipped with a discharge head for discharging an ultraviolet ray curable-type composition containing the acyl phosphine oxide-based photopolymerization initiator toward an attachment object, including a polymerizable compound in which a saturation solubility of an acyl phosphine oxide-based photopolymerization initiator at 20° C. is equal to or greater than 5.0% by mass.

The present invention relates to a photocurable acrylic resin which is a polymer of a monomer mixture including a crosslinkable monomer represented by [Formula 1]; a (meth)acrylic monomer including a photoinitiating functional group; and an alkyl (meth)acrylate-based monomer, and has a weight average molecular weight of 100,000 to 500,000, and a branch-type polymer structure, and an adhesive composition and an adhesive film including the same.

The present invention relates to a photocurable acrylic resin which is a polymer of a monomer mixture including a crosslinkable monomer represented by [Formula 1]; a (meth)acrylic monomer including a photoinitiating functional group; and an alkyl (meth)acrylate-based monomer, and has a weight average molecular weight of 100,000 to 500,000, and a branch-type polymer structure, and an adhesive composition and an adhesive film including the same.

An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be formed even after the composition is stored for a long period of time. In addition, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin of which polarity increases through decomposition by an action of an acid, and a compound that generates an acid upon irradiation with actinic rays or radiation, and the compound that generates an acid upon irradiation with actinic rays or radiation is selected from compounds (I) and (II).

An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be formed even after the composition is stored for a long period of time. In addition, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin of which polarity increases through decomposition by an action of an acid, and a compound that generates an acid upon irradiation with actinic rays or radiation, and the compound that generates an acid upon irradiation with actinic rays or radiation is selected from compounds (I) and (II).

A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group, Va.sup.1 is a divalent hydrocarbon group, n.sub.a1 represents an integer of 0 to 2, Ya.sup.0 is a carbon atom, Xa.sup.0 is a group forming a monocyclic aliphatic hydrocarbon group together with Ya.sup.0, and Ra.sup.00 is an aromatic hydrocarbon group or a specific unsaturated hydrocarbon group. In general formula (b1), R.sup.b1 represents a cyclic hydrocarbon group, Y.sup.b1 represents a divalent linking group containing an ester bond, V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, and M.sup.m+ is an m-valent organic cation.

##STR00001##

A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), R.sup.b1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Y.sup.b1 represents a divalent linking group containing an ester bond (—C(═O)—O— or —O—C(═O)—), V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and M.sup.m+ represents an m-valent organic cation.

R.sup.b1—Y.sup.b1—V.sup.b1—CF.sub.2—SO.sub.3.sup.−(M.sup.m+).sub.1/m  (b1)

Acrylic syrup polymer composition are provided by partially polymerizing a (meth)acrylic monomer mixture in the presence of a thiol chain transfer agent to produce a first syrup polymer composition comprising a low molecular weight solute (meth)acrylic copolymer and solvent monomers, quenching the chain transfer agent, further polymerizing the first syrup polymer composition to produce a second syrup polymer composition comprising the low molecular weight solute acrylic copolymer, a high molecular weight solute acrylic copolymer and optionally unreacted solvent monomers, optionally adding a crosslinker and photoinitiator; and further photopolymerizing the syrup polymer composition to produce a pressure-sensitive adhesive.

Acrylic syrup polymer composition are provided by partially polymerizing a (meth)acrylic monomer mixture in the presence of a thiol chain transfer agent to produce a first syrup polymer composition comprising a low molecular weight solute (meth)acrylic copolymer and solvent monomers, quenching the chain transfer agent, further polymerizing the first syrup polymer composition to produce a second syrup polymer composition comprising the low molecular weight solute acrylic copolymer, a high molecular weight solute acrylic copolymer and optionally unreacted solvent monomers, optionally adding a crosslinker and photoinitiator; and further photopolymerizing the syrup polymer composition to produce a pressure-sensitive adhesive.

Disclosed are a resin containing a structural unit represented by formula (I), a structural unit represented by formula (a1-1), a structural unit represented by formula (a1-2) and a structural unit represented by formula (a2-A), and a resist composition including the same: ##STR00001##