C08F220/305

RESIN COMPOSITION, OPTICAL FIBER, AND METHOD FOR PRODUCING OPTICAL FIBER
20230242690 · 2023-08-03 · ·

A resin composition for secondary coating of an optical fiber contains a photopolymerizable compound and a photopolymerization initiator, wherein the photopolymerizable compound contains: a urethane (meth)acrylate that is a reaction product of a polyol having a number average molecular weight of 300 or more and 1200 or less, a diisocyanate, and a hydroxyl group-containing (meth)acrylate; a bisphenol skeleton-containing (meth)acrylate; and a monofunctional (meth)acrylate in which a glass transition temperature of a homopolymer of the monofunctional (meth)acrylate is −60° C. or more and 15° C. or less; and when the resin composition is ultraviolet-cured under conditions of an accumulated amount of light of 1000 mJ/cm.sup.2 and an illumination of 1000 mW/cm.sup.2 to form a resin film, the Young's modulus of the resin film is 1200 MPa or more and 3000 MPa or less at 23° C., and the glass transition temperature of the resin film is 70° C. or more and 105° C. or less.

RESIN COMPOSITION, OPTICAL FIBER, AND METHOD FOR PRODUCING OPTICAL FIBER
20230242690 · 2023-08-03 · ·

A resin composition for secondary coating of an optical fiber contains a photopolymerizable compound and a photopolymerization initiator, wherein the photopolymerizable compound contains: a urethane (meth)acrylate that is a reaction product of a polyol having a number average molecular weight of 300 or more and 1200 or less, a diisocyanate, and a hydroxyl group-containing (meth)acrylate; a bisphenol skeleton-containing (meth)acrylate; and a monofunctional (meth)acrylate in which a glass transition temperature of a homopolymer of the monofunctional (meth)acrylate is −60° C. or more and 15° C. or less; and when the resin composition is ultraviolet-cured under conditions of an accumulated amount of light of 1000 mJ/cm.sup.2 and an illumination of 1000 mW/cm.sup.2 to form a resin film, the Young's modulus of the resin film is 1200 MPa or more and 3000 MPa or less at 23° C., and the glass transition temperature of the resin film is 70° C. or more and 105° C. or less.

LAMINATE, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE
20220119688 · 2022-04-21 · ·

Provided is a laminate which is suppressed in crystal precipitation in a transparent resin film containing an ultraviolet absorber even in an evaluation of moisture-heat resistance and which has an optically anisotropic layer exhibiting excellent light resistance; a liquid crystal display device; and an organic EL display device. The laminate includes a transparent resin film and an optically anisotropic layer, in which the transparent resin film contains a resin and a resin and a compound represented by Formula (I), the resin is at least one resin selected from the group consisting of a cellulose-based resin, a (meth)acrylic resin, a polyester-based resin, a polyamide-based resin, a polyimide-based resin, and a cycloolefin-based resin, and the optically anisotropic layer is a layer formed of a composition containing a polymerizable liquid crystal compound exhibiting reverse wavelength dispersibility.

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LAMINATE, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE
20220119688 · 2022-04-21 · ·

Provided is a laminate which is suppressed in crystal precipitation in a transparent resin film containing an ultraviolet absorber even in an evaluation of moisture-heat resistance and which has an optically anisotropic layer exhibiting excellent light resistance; a liquid crystal display device; and an organic EL display device. The laminate includes a transparent resin film and an optically anisotropic layer, in which the transparent resin film contains a resin and a resin and a compound represented by Formula (I), the resin is at least one resin selected from the group consisting of a cellulose-based resin, a (meth)acrylic resin, a polyester-based resin, a polyamide-based resin, a polyimide-based resin, and a cycloolefin-based resin, and the optically anisotropic layer is a layer formed of a composition containing a polymerizable liquid crystal compound exhibiting reverse wavelength dispersibility.

##STR00001##

(Meth)acrylate, monomer composition, dental material obtained from composition, and production method thereof
11407846 · 2022-08-09 · ·

Provided are a monomer which can provide a cured product having both high toughness and rigidity, a monomer composition containing the monomer, the monomer composition used as a dental material monomer composition, a dental material composition containing the monomer composition or the dental material monomer composition, a cured product thereof having excellent mechanical properties, a dental material formed by curing the dental material composition, a method for producing the monomer composition, and a method for producing the dental material. A (meth)acrylate (D) is a reaction product of an amine compound (A) having two or more amino groups, an iso(thio)cyanate compound (B) having two or more iso(thio)cyanato groups, and a hydroxy (meth)acrylate compound (C) having one or more polymerizable groups.

(Meth)acrylate, monomer composition, dental material obtained from composition, and production method thereof
11407846 · 2022-08-09 · ·

Provided are a monomer which can provide a cured product having both high toughness and rigidity, a monomer composition containing the monomer, the monomer composition used as a dental material monomer composition, a dental material composition containing the monomer composition or the dental material monomer composition, a cured product thereof having excellent mechanical properties, a dental material formed by curing the dental material composition, a method for producing the monomer composition, and a method for producing the dental material. A (meth)acrylate (D) is a reaction product of an amine compound (A) having two or more amino groups, an iso(thio)cyanate compound (B) having two or more iso(thio)cyanato groups, and a hydroxy (meth)acrylate compound (C) having one or more polymerizable groups.

ADDITIVE MANUFACTURING USING MATERIALS THAT FORM A WEAK GEL
20220089868 · 2022-03-24 · ·

A formulation usable in additive manufacturing of a three-dimensional object is provided. The formulation comprises one or more monofunctional curable material(s); one or more hydrophilic multifunctional curable material(s); and one or more water-miscible non-curable material(s), such that a total amount of the curable materials is 20% or less, by weight, and a weight ratio of a total weight of the monofunctional curable material(s) and a total weight of the hydrophilic multifunctional curable material(s) ranges from 1:1 to 10:1. The formulation features, when hardened, properties of a weak and flowable gel. Additive manufacturing processes utilizing the formulation as a support material formulation are also provided.

Curable composition
11306160 · 2022-04-19 · ·

An object of the present invention is to provide a curable composition having sufficient polymerization properties even under acidic conditions. The curable composition of the present invention includes (a) a polymerizable monomer having an acidic group, (b) a transition metal compound, (c) at least one compound selected from benzoxazole compounds and benzothiazole compounds, and (d) a reducing agent.

Curable composition
11306160 · 2022-04-19 · ·

An object of the present invention is to provide a curable composition having sufficient polymerization properties even under acidic conditions. The curable composition of the present invention includes (a) a polymerizable monomer having an acidic group, (b) a transition metal compound, (c) at least one compound selected from benzoxazole compounds and benzothiazole compounds, and (d) a reducing agent.

Protective film composition and method of manufacturing semiconductor package by using the same

A protective film composition includes a polymer having the following formula: ##STR00001## each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R.sup.1, R.sup.2, and R.sup.3 is a hydrogen atom or a methyl group; R.sup.4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R.sup.5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.