Patent classifications
C08G18/4854
THERMOPLASTIC POLYURETHANE FOAM AND IMPACT RESISTANT COMPOSITE LAMINATE COMPRISING THE SAME
Provided are a thermoplastic polyurethane foam and an impact resistant composite laminate. The thermoplastic polyurethane comprises a structural unit represented by Formula (I):
##STR00001## wherein each R independently is an alkylene group having 2 to 8 carbon atoms or —CH.sub.2CH.sub.2OCH.sub.2CH.sub.2— or —CH.sub.2CH.sub.2OCH.sub.2CH.sub.2OCH.sub.2CH.sub.2—; n is a number from 2 to 13; and the structural unit has a Mn ranging from 700 g/mole to 2500 g/mole. The impact resistant composite laminate comprises a base layer and a first impact resistant layer formed by the thermoplastic polyurethane foam, and the first impact resistant layer overlaps the base layer.
Urethane adhesive cord treatment for power transmission belt and belt
A belt with a tensile cord embedded in an elastomeric body, having an adhesive composition impregnating the cord and coating the fibers. The adhesive composition is the reaction product of a polyisocyanate and a polyol, or a polyurethane prepolymer derived therefrom, and a polyamine curative and optionally additional polyol, and with optionally added plasticizer. At least one of the polyisocyanate, the prepolymer, and the polyamine are blocked with a blocking agent. The belt body may be of cast polyurethane, vulcanized rubber, or thermoplastic elastomer. The cord may have an adhesive overcoat.
Composition for a polishing pad, polishing pad, and process for preparing the same
In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.
3D spacer fabric reinforced PU composite and its use
Described herein is a 3D spacer fabric reinforced composite, a process for producing it, a method of using it in footwear, and a footwear including it.
Multiphase coatings with separated functional particles, and methods of making and using the same
Some variations provide a multiphase polymer composition comprising a first polymer material and a second polymer material that are chemically distinct, wherein the first polymer material and the second polymer material are microphase-separated on a microphase-separation length scale from about 0.1 microns to about 500 microns, wherein the multiphase polymer composition comprises first solid functional particles selectively dispersed within the first polymer material, and wherein the first solid functional particles are chemically distinct from the first polymer material and the second polymer material. Some embodiments provide an anti-corrosion composition comprising first corrosion-inhibitor particles or precursors selectively dispersed within the first polymer material, wherein the multiphase polymer composition optionally further comprises second corrosion-inhibitor particles or precursors selectively dispersed within the second polymer material. These multiphase polymer compositions may be used for other applications, such as self-cleaning, self-healing, or flame-retardant coatings. Methods of making and using these multiphase polymer compositions are disclosed.
Garment incorporating waterproof or water resilient aqueous polyurethane dispersions and/or having altered stress profile
Articles, such as garments, including films comprising dried aqueous polyurethane dispersions are disclosed, whereby the garment has an altered stress which is exhibited during wear of the garment and/or has one or more sections of waterproof or water-resilient fabric. The film may be bonded to the fabric of the article to provide a fabric or film laminate.
Method for preparing novel waterborne polyurethane foam layer for synthetic leather
A method for preparing a novel waterborne polyurethane foam layer for synthetic leather is disclosed. The method includes first preparing a charged cellulose nanofiber by using a wood pulp as a raw material; meanwhile, subjecting a polyisocyanate, a macromolecular diol, a hydrophilic chain extender and a small molecular chain extender to a polyaddition reaction and an acid-base neutralization reaction in sequence, to obtain a cationic or anionic waterborne polyurethane; adding the charged cellulose nanofiber and a certain amount of a crosslinking agent to the oppositely charged ionic waterborne polyurethane emulsion, stirring the resulting mixture, forming a bimolecular layer at the gas/liquid interface by a self-assembly of the cellulose nanofiber and waterborne polyurethane nanoparticles through electrostatic interactions to obtain a stable Pickering foam; using the stable Pickering foam as a template, drying and solidifying to obtain the waterborne polyurethane foam layer for synthetic leather.
Methods and compositions for polyurethane dispersions using caprolactam-derived solvents
Caprolactam-derived solvents for use as processing solvents and/or coalescing agents for polyurethane dispersions (PUDs). The caprolactam-derived solvents are suitable for processing solvents and coalescing agents in PUDs created through traditional PUD manufacturing processes or as coalescing agents in PUDs created through solvent-free PUD manufacturing processes. Blends of more than one caprolactam-derived solvent may be used as the processing solvent and/or coalescing agent.
POLYCARBONATE DIOL COMPOSITION
A polycarbonate diol composition comprising polycarbonate diol having a structure represented by the following general formula (I) and a polycarbonate structure represented by the following general formula (II), wherein melt viscosity at 50° C. is 1000 to 10000 mPa.Math.s, and an average value of the number of repeats represented by n11 in the following general formula (I) is 12 or larger:
##STR00001##
POLISHING PAD AND METHOD FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME
The present invention relates to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to an embodiment can achieve low hardness by comprising a polishing layer formed using a curing agent of specific components. It is possible to enhance the mechanical properties of the polishing pad, as well as to improve the surface defects appearing on the surface of a semiconductor substrate, by controlling the surface roughness reduction rate and the recovery elasticity index of the polishing pad to specific ranges. It is also possible to further enhance the polishing rate.