Patent classifications
C08G18/8116
FLUORINE-CONTAINING ISOCYANUL COMPOUND
A compound of formula (I) having the structure shown below:
##STR00001##
wherein R.sup.B, R.sup.F1, R.sup.A1, X.sup.a and X.sup.b are as defined herein.
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
Photo-alignable polymer, binder composition, binder layer, optical laminate, method for producing optical laminate, and image display device
An object of the present invention is to provide a photo-alignable polymer which has excellent coating properties, is capable of suppressing film thickness unevenness, and has excellent upper layer coating properties and good liquid crystal alignment properties after being formed as a layer; a binder composition; a binder layer; an optical laminate; a method for producing an optical laminate; and an image display device. The photo-alignable polymer of an embodiment of the present invention is a photo-alignable polymer having a repeating unit A including a cleavage group capable of decomposing by an action of at least one selected from the group consisting of light, heat, an acid, and a base to generate a polar group, in which the repeating unit A has the cleavage group in a side chain, has a fluorine atom or a silicon atom on a side closer to a terminal than the cleavage group in the side chain, and the photo-alignable polymer satisfies Condition 1 or Condition 2 shown below. Condition 1: The photo-alignable polymer further has a repeating unit B including a photo-alignable group, in addition to the repeating unit A. Condition 2: The repeating unit A includes a photo-alignable group on a side closer to the main chain than the cleavage group in the side chain.
COMPOSITION FOR ADHESIVES, OUTER PACKAGE MATERIAL FOR ELECTRICITY STORAGE DEVICES, AND METHOD FOR PRODUCING SAME
Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.
COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND
The composition comprises a compound (A) represented by general formula (1) and a compound (B) represented by general formula (2), and comprises 0.00002 to 2.0 parts by mass of the compound (B) with respect to 100 parts by mass of the compound (A),
(R.sub.1—COO).sub.n—R.sub.2—(NCO).sub.m (1)
g(R.sub.1—COO).sub.n—R.sub.2—NHC(═O)NH—R.sub.2—(OCO—R.sub.1).sub.m (2)
wherein in general formulae (1) and (2), R.sub.1 is an ethylenically unsaturated group having 2 to 7 carbon atoms; R.sub.2 is a (m+n)-valent hydrocarbon group having 1 to 7 carbon atoms and optionally contain an ether group; R.sub.1 and R.sub.2 in the general formula (1) are the same as R.sub.1 and R.sub.2 in the general formula (2); and n and m each represent an integer of one or two.
UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.
Photopolymerizable compositions including a urethane component and a monofunctional reactive diluent, articles, and methods
The present disclosure provides a photopolymerizable composition. The photopolymerizable composition includes at least one urethane component, at least one monofunctional reactive diluent, an initiator, and optionally an inhibitor. The present disclosure also provides an article including the reaction product of the photopolymerizable composition. Further, the present disclosure provides a method of making an article. The method includes (i) providing a photopolymerizable composition and (ii) selectively curing the photopolymerizable composition to form an article. The method optionally also includes (iii) curing unpolymerized urethane component and/or reactive diluent remaining after step (ii). Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an article; and generating, with the manufacturing device by an additive manufacturing process, the article based on the digital object. A system is also provided, including a display that displays a 3D model of an article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an article.
UV AND/OR HEAT CURABLE SILICONE BASED MATERIALS AND FORMULATIONS
The present disclosure is directed to a process for the preparation of curable, (meth)acrylate functionalized polysiloxanes. In addition, the present disclosure is directed to a curable, (meth)acrylate-functionalized polysiloxane obtained thereby and curable compositions comprising these curable, (meth)acrylate-functionalized polysiloxanes.
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.
ORTHODONTIC ARTICLES PREPARED USING A POLYCARBONATE DIOL, AND METHODS OF MAKING SAME
The present disclosure provides an orthodontic article including the reaction product of the photopolymerizable composition. The photopolymerizable composition includes i) a monofunctional (meth)acrylate monomer whose cured homopolymer has a glass transition temperature of 90 degrees Celsius or greater; ii) a photoinitiator; and iii) a polymerization reaction product of components. The components include 1) an isocyanate; 2) a (meth)acrylate mono-ol; 3) a polycarbonate diol; and 4) a catalyst. Further, the present disclosure provides a method of making an orthodontic article. The method includes obtaining a photopolymerizable composition and selectively curing the photopolymerizable composition to form an orthodontic article. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an orthodontic article; and generating, with the manufacturing device by an additive manufacturing process, the orthodontic article based on the digital object. A system is also provided, including a display that displays a 3D model of an orthodontic article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an orthodontic article.