C08G59/245

Thiol-cured elastomeric epoxy resins

Elastomers are formed by curing a reaction mixture that includes an polyepoxide-terminated polyether having a linear or branched polyether chain that has a molecular weight of at least 2000, at least two epoxide groups that has an epoxide equivalent weight of at least 400 2) a curing agent containing at least one polythiol compound having at least two thiol groups and an equivalent weight per thiol group of up to 500, and 3) at least one base catalyst.

One-pack type adhesive and fuel cell separator

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).

Thermal cycling resistant low density composition
11667807 · 2023-06-06 · ·

A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm.sup.3.

Adhesion promoters and compositions for containers and other articles

This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Curable composition, curable paste material, curable sheet material, curable modeling material, curing method, and cured product

A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream. (f) The ratio of the number of epoxy groups to the number of imidazole rings in the epoxy resin composition is from 25 to 90 (inclusive).

Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
11499004 · 2022-11-15 · ·

A curing agent composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. Methods for the chemical fastening of construction elements in boreholes and the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening are provided, the epoxy resin compound including a benzoxazine-amine adduct and an amine which is reactive to epoxy groups.

Casting Cores And Producing Slips

The present disclosure relates to casting cores. The teachings thereof may be embodied in methods for producing a slip and components produced using such methods. For example, a method for producing a slip may include: mixing at least one inorganic constituent with at least one binder, wherein the binder comprises at least one epoxy resin and at least one silicone copolymer.

EPOXY RESIN COMPOSITION AND FIBER REINFORCED COMPOSITE MATERIAL

An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.

EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND COMPOSITE MATERIAL

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa.Math.m.sup.1/2 or more, and a glass transition temperature of 150° C. or higher.