The invention relates to a curing agent composition for an epoxy resin compound for the chemical fastening of construction elements, to an epoxy resin compound, and to a multi-component epoxy resin system. The invention further relates to a method for the chemical fastening of construction elements in boreholes. The invention also relates to the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound comprising 3-aminomethyl-3,5,5-trimethylcyclohexane and at least one further cycloaliphatic amine which is reactive to epoxy groups.

An epoxy resin composition includes a polyol (A) having a hydroxyl value of 130 to 600 mgKOH/g, an epoxy resin (B), an amine curing agent (C), and a toughener (D). The epoxy resin composition may satisfy both 0.1≤Wt.sup.2/Wp≤8.0 and 0.1≤Wp≤8.0, where Wp represents the polyol (A) content of the composition in % by weight and Wt represents the toughener (D) content of the composition in % by weight, relative to a total amount of the polyol (A), the epoxy resin (B), the amine curing agent (C), and the toughener (D).

The present invention relates to styrenated phenol useful as a curing agent or a plasticizing agent for an epoxy resin. More particularly, it relates to use of styrenated phenol, which has viscosity and curing properties similar to those of nonylphenol and exhibits superior curing properties for an epoxy resin, as a curing agent or a plasticizing agent for an epoxy-cured paint.

An amine hardener system useful for curing a curable resin composition including a blend of: (I) a first amine hardener comprising at least one cycloaliphatic amine; and (II) a second amine hardener comprising at least one polyetheramine; and a curable epoxy resin composition including (A) at least one epoxy resin compound; and (B) at least one curing agent; wherein the at least one curing agent includes the above amine hardener system.

A resin composition for producing a composite, wherein the composition comprises (a) resin component comprising a glycidyl bisphenol Z epoxy resin, and (b) a curing agent.

The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.

Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

The purpose of the present invention is to provide a surface sealing material which has high storage stability and is capable of forming, on an object to be coated such as an organic EL element, a cured product layer that has less irregularity, cissing and the like, while having high surface smoothness. A surface sealing material for organic EL elements according to the present invention contains (B) a cationically polymerizable compound that comprises a cationically polymerizable functional group in each molecule and has a structure represented by formula (1) —(R—O).sub.n— (wherein R represents an alkylene group having 2-5 carbon atoms and n represents an integer of 1-150), (C) a thermal cationic polymerization initiator and (D) a leveling agent.

The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

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