A composition of the present disclosure includes an aqueous dispersion of epoxy resin particles. The epoxy resin particles include at least two 1,2-epoxide groups. The composition further includes one or more anti-adhesive agents, one or more anti-microbial agents, or a combination of one or more anti-adhesive agents and one or more anti-microbial agents.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of −60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).

The present disclosure relates to a UV-curable composition and adhesive film, adhesive tape and bonding member containing the same. Said UV-curable composition is a UV-curable composition catalyzable by photobase. Said UV-curable composition comprises (1) acrylic polymer and/or ethylene-vinyl acetate copolymer; (2) curable components, comprising polyfunctional mercaptan and polyfunctional epoxy resin; and a (3) photobase generator. The composition of the present disclosure can be coated into an adhesive tape or adhesive film; such adhesive tape or film possesses initial adhesion before UV curing is carried out and can have the strength of a semi-structural adhesive or a structural adhesive after UV curing is carried out.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

A curable epoxy composition suitable for surface application, comprising one or more epoxy resin(s); 2,4,6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

A curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) can be used in an epoxy resin composition for chemical fastening of structural elements. A corresponding epoxy resin composition and multi-component epoxy resin system can contain the curing agent composition. A method can be used for chemical fastening of structural elements in boreholes with the epoxy resin composition or the multi-component epoxy resin system.

The disclosure relates to epoxy-based compositions comprising a decarboxylated rosin acid (DCR) component, suitable as an efficient plasticizer. It further improves hardness, elasticity, UV exposure viability properties of the paint and coating compositions. The DCR increases the bio-based renewable material content of a coating formulation and provide solutions for phthalate-free products. The DCR has a density of 0.9 to 1.0 g/cm.sup.3, a flash point of 135 to 175° C., an acid value of < 50 mg KOH/g, measured according to ASTM D465, and a viscosity of 15 to 60 cSt at 40° C., measured according to ASTM D-445.

A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.