Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

An amine-functional adduct from the reaction of an amine mixture containing at least one diamine of formula (I) and at least one diamine of formula (II) in a weight ratio ranging from 65/35 to 95/5 with at least one diepoxide in a stoichiometric ratio of at least 1. 2 moles of diamine of the formula (I) to 1 mole equivalent of epoxide groups. The adduct is liquid at room temperature without diluent even in the presence of a small excess of diamine and is surprisingly low in viscosity. In addition, it is particularly cost-effective, as it is available from an amine mixture that is technically easy to produce. The adduct enables low-emission or emission-free epoxy resin coatings with surprisingly good workability at surprisingly fast curing, which have a high hardness and low tendency to yellowing, and which hardly tend to blushing-related defects even in cold and humid conditions.

A thermoplastic resin composition for a millimeter-wave radar member, is provided, which comprises, relative to 100 parts by mass of a polybutylene terephthalate resin (A), 15 to 65 parts by mass of a rubber-reinforced polystyrene resin (B1) and/or 10 to 70 parts by mass of a polycarbonate resin (B2) as a component (B), 0.1 to 3 parts by mass of an epoxy compound (D), and 30 to 150 parts by mass of glass fiber (E).

An object of the present invention is to provide a composition capable of forming a thermally conductive sheet having excellent peel strength. In addition, another object of the present invention is to provide a thermally conductive sheet formed of the composition and a device with a thermally conductive sheet.

The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

The present invention relates novel furan based amine cross-linkers with improved thermomechanical and water barrier properties. The novelty of this invention is the use of aromatic, and hydrophobic aliphatic aldehydes to bridge two furfuryl amines, which yields a diamine or tetra amines with a significantly enhanced hydrophobic character. These diamine cross-linkers exhibit enhanced water barrier properties and thermomechanical properties when cured with both commercial and synthetic epoxies.

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

The present invention provides boron nitride particles that can be used for preparation of a thermally conductive material having excellent thermally conductive properties and peel strength. In addition, the present invention provides a composition for forming a thermally conductive material, a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer, in relation to the boron nitride particles. In the boron nitride particles of the present invention, an atomic concentration ratio of oxygen atomic concentration to boron atomic concentration on a surface, detected by X-ray photoelectron spectroscopy, is 0.12 or greater, and a D value obtained by Equation (1) is 0.010 or less.

D value=B(OH).sub.3(002)/BN(002)  Equation (1) B(OH).sub.3(002): Peak strength derived from a (002) plane of boron hydroxide having a triclinic space group measured by X-ray diffraction BN(002): Peak strength derived from the (002) plane of boron nitride having a hexagonal space group measured by X-ray diffraction.