The present invention is directed to a liquid one component (1 K) composition comprising, based on the weight of the composition: from 10 to 90 wt.% of a) at least one epoxy resin; from 0.5 to 30 wt.% of b) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of tertiary amines; from 10 to 50 wt.% of c) at least one (meth)acrylamide monomer of Formula (VII): [00001] wherein: R.sup.a is H or Me; G is selected from —NH.sub.2, —NHR.sup.b and —N(R.sup.b)(R.sup.c); R.sup.b and R.sup.care independently selected from C.sub.1-C.sub.18 alkyl, C.sub.1-C.sub.18 hydroxyalkyl, C.sub.1-C.sub.18 alkalkoxy, C.sub.6-C.sub.18 aryl and —(CH.sub.2).sub.n —N(R.sup.d)(R.sup.e); n is an integer of from 1 to 4; and, R.sup.d and R.sup.e are independently selected from H and C.sub.1-C.sub.6 alkyl; and, from 0.05 to 10 wt.% of d) at least one free radical photoinitiator.

An electrode body having an electrode, and a primer layer or a plurality of primer layers laminated on the electrode, wherein the at least one primer layer is an in-situ polymerizable composition layer formed from a polymerization product of an in-situ polymerizable composition, a method for producing an electrode body, and an electrochemical element.

A conductive paste for an electrolytic capacitor used for connecting a cathode part and a cathode lead terminal of the electrolytic capacitor. The conductive paste includes a thermosetting resin, and conductive particles, and the conductive particles include flaky metal particles and acicular conductive particles. The content of the conductive particles in the conductive paste is, for example, 50 mass % or more and 70 mass % or less, and the mass ratio of the flaky metal particles to the total of the flaky metal particles and the acicular conductive particles is, for example, 60% or more and 80% or less.

Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1):

##STR00001##

wherein X is an oxygen atom or a sulfur atom; R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group, or an aryl group; and R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group, or an aryl group, or R.sup.3 and R.sup.4 are connected to each other to represent a divalent group to form a ring.

An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition.

##STR00001##

The definition of Chemical Formula 1 is as described in the detailed description.

This invention relates generally to the field of quasicrystalline strictures. In preferred embodiments, the stopgap structure is more spherically symmetric than periodic structures facilitating the formation of stopgaps in nearly all directions because of higher rotational symmetries. More particularly, the invention relates to the use of quasicrystalline structures for optical, mechanical, electrical and magnetic purposes. In some embodiments, the invention relates to manipulating, controlling, modulating and directing waves including electromagnetic, sound, spin, and surface waves, for pre-selected range of wavelengths propagating in multiple directions.

An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.

Disclosed herein is an aqueous coating composition containing an aqueous epoxy resin dispersion, an aqueous amine-functional resin dispersion and an aromatic carboxylic acid. The aqueous dispersion contains at least one specific di- and/or polyfunctional monomeric amine and at least one resin component including at least one specific polyfunctional organic amine. Further disclosed herein is a kit-of-parts including a base varnish containing the aqueous epoxy resin dispersion and a curing component containing the aqueous amine-functional resin dispersion as well as the aromatic carboxylic acid. Additionally disclosed herein is a process for producing a coating on the substrate as well as coated substrates resulting from said process. Cured coating layers formed from said compositions exhibit a good adhesion to the substrate as well as a high intercoat adhesion and blistering stability under humidity conditions without negatively influencing the excellent sandability and the good stone chipping properties.

A thermoplastic polyester resin composition is obtained by blending, with respect to (A) 100 parts by weight of a thermoplastic polyester resin, (B) 0.1-50 parts by weight of at least one phosphinate selected from phosphinates and diphosphinates, (C) 0.1-10 parts by weight of a phosphazene compound, (D) 0.1-50 parts by weight of a nitrogen-based flame retardant, (E) 0.1-10 parts by weight of a polyfunctional epoxy compound, and (F) 0.1-20 parts by weight of an olefin resin. The ratio of the parts by weight of component (B) and the parts by weight of component (C) is 2.0-8.0.