An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I):

##STR00001##

wherein X is selected from a single bond and a linkage group.

Various embodiments of the teachings herein include a powder coating or wet enamel for production of an insulation system of an electrical machine including a curable resin-resin or resin-hardener mixture in solid form as a powder coating formulation at room temperature or processed in a solvent to give a wet enamel. The mixture may include: a first hydrocarbon-based resin component with at least two epoxy groups; a second silicon-oxygen-based resin component with at least one hydroxyl functionality; and a hardener and/or an initiating catalyst. The first resin component is predominant by composition.

The present invention is directed to a two component (2K) composition based on modified epoxy resins. More particularly, the present invention is directed to a two component (2K) composition comprising, as a first component, a silicone-based resin comprising epoxy functionalities and, as a second component, a curative comprising at least one alkoxy-containing aminofunctional silicone resin: the reaction of the two components of said composition provides a cured product exhibiting abrasion and corrosion resistance.

A piezoelectric composite for use in an ultrasonic transducer and a method of forming the same is provided. The composite has a piezoelectric ceramic component and a hydrophobic polymer component arranged to form a 1-3, 2-2, or 3-3 composite type. In one embodiment, the hydrophobic polymer is selected to polymerize at a moderate temperature.

Thermally reworkable epoxy resins prepared through a Diels-Alder reaction are described herein. A maleimide component is reacted with an electron donating component having a furan ring attached to an epoxy ether to produce the epoxy resins. The epoxy component generated by this method can be cured with different diamines lo form a robust network of epoxy material. The robust epoxy material is used as a reversible thermoset and as an adhesive. The robust epoxy network is heated at 90 C. temperature in a retro Diels-Alder fashion to produce colorless starting materials of the maleimide component and the furan component.

An epoxy-functional coupling agent comprises a reaction product of a polyepoxide and an aminosilane represented N by the formula HNR.sup.1R.sup.2. R.sup.1 represents ZSiL.sub.3 and R.sup.2 represents ZSiL.sub.3 or an alkyl group having from 1 to 4 carbon atoms. Each Z independently represents a divalent linking group having from 1 to 18 carbon atoms, and each L independently represents a hydrolyzable group. The coupling agent may be used to treat a substrate such as an abrasive particle, which may be included in a resin bond abrasive article.

An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I): ##STR00001##
wherein X is selected from a single bond and a linkage group.