The present invention addressed the problem of providing a highly reliable thermosetting resin composition which is suitable for use in a sealing material for a semiconductor device and in which warpings and cracks do not occur even when used in a power device, in particular. The problem is solved by a thermosetting resin composition that includes a thermosetting resin and a curing catalyst, wherein the cured product of the thermosetting resin composition has a storage modulus at 25 C. of 1.010.sup.6 Pa to 1.010.sup.10 Pa and an average linear expansion coefficient at 70 to 210 C. of 100 ppm/K or less.

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition.

Disclosed is an epoxy resin represented by the following Formula (1):

##STR00001## wherein R.sup.1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R.sup.2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R.sup.3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R.sup.4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R.sup.5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.

The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant propertiesspecifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processabilityspecifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.

The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1),

##STR00001##

component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

A resin composition of the present invention contains: an epoxy resin (A); a hardener (B); and an ion exchanger (C). At least one of the epoxy resin (A) and the hardener (B) contains a modified silicone (S), and the epoxy resin (A) is at least one type selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, and an epoxy-modified silicone.

Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.

Various teachings of the present disclosure include a sub-conductor insulation with a prepreg including a solid insulation material in a prepreg matrix. The prepreg matrix includes solid insulation material in the form of layers, laminate layers, tapes, as paper and/or in the form of bound barrier material particles. The solid insulation material comprises at least partial discharge-resistant material. The prepreg matrix includes carbon compounds and up to 45 wt % of the total weight of the prepreg matrix of one or more silicon-containing components. The solid insulation material is embedded in the prepreg matrix and is wound in a precured B-stage as sub-conductor insulation.

The present invention relates to oligosiloxane epoxy based dynamic adaptable networks and processes of making and using the same. Articles produced from such oligosiloxane dual-dynamic adaptable networks exhibit good structural integrity yet are reprocessable. Such articles can form chemical bond welds with other articles that possess siloxane and/or ester functionality within the network.

An epoxy resin composition includes (A) an epoxy resin containing two or more epoxide groups in one molecule, (B) a polyorganosiloxane compound represented by the following general formula (1), and (C) an epoxy resin curing agent, wherein the epoxy resin composition includes 1 to 40 parts by mass of the component (B) relative to 100 parts by mass of the component (A). Thus, provided is: an epoxy resin composition configured to exhibit a property of increasing both an elongation property and tensile shear strength; a cured material thereof; and an epoxy adhesive.

##STR00001##

A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200 C. is expressed as 1 [K.sup.1], at least one of requirements 1/210 and (12).sup.210.sup.80.4 is satisfied, where a reference value 2 is 35010.sup.6 [K.sup.1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09Ia/Ib3.0 and 0.04Ic/Ib1.0 are satisfied.