Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

An object of the present invention is to provide a technique suitable for achieving low wiring resistance and reducing a variation in the resistance value between semiconductor elements to be multilayered in a method of manufacturing a semiconductor device in which the semiconductor elements are multilayered through laminating semiconductor wafers via an adhesive layer. The method of the present invention includes first to third processes. In the first process, a wafer laminate Y is prepared, the wafer laminate Y having a laminated structure including a wafer 3, wafers 1T with a thickness from 1 to 20 um, and an adhesive layer 4 with a thickness from 0.5 to 4.5 μm interposed between a main surface 3a of the wafer 3 and a back surface 1b of the wafer 1T. In the second process, holes extending from the main surface 1a of the wafer 1T and reaching a wiring pattern of the wafer 3 are formed by a predetermined etching treatment. In the third process, the holes are filled with a conductive material to form through electrodes. The adhesive layer 4 has an etching rate of 1 to 2 μm/min in dry etching performed using an etching gas containing CF.sub.4, O.sub.2, and Ar at a volume ratio of 100:400:200 under predetermined conditions.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

Various embodiments include an insulation material and/or impregnation resin for a wrapping tape insulation, comprising: a base resin curing to a thermoset; and a curing agent. The base resin comprises a siloxane-containing compound forming a —SiR.sub.2—O— backbone in the thermoset.

An epoxy-containing siloxane-modified resin, a package material, and a package structure are provided. The epoxy-containing siloxane-modified resin is formed by reacting a hydroxy terminated siloxane compound with a siloxane resin, and then reacting with an epoxy silane. The hydroxy terminated siloxane compound and the siloxane resin have a molar ratio of 5:1 to 10:1, and the epoxy silane and the siloxane resin have a molar ratio of 2:1 to 4:1.

A laminate comprising a plastic substrate (A); a hardened organic polymer layer (B) provided on a surface of the plastic substrate (A) and having a storage elastic modulus of from 0.01 to 5 GPa and tan δ of from 0.1 to 2.0 at 25° C. which are measured at a temperature elevating rate of 2° C./min by a dynamic viscoelasticity test stipulated in JIS K 7244; an organic/inorganic composite layer (C) provided on a surface of the hardened organic polymer layer (B) and containing covalently bound organic polymer and metal oxide nanoparticles; and an inorganic layer (D) provided on a surface of the organic/inorganic composite layer (C) and comprising secondary particles of ceramic or metal.

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiR.sup.5.sub.cX.sub.3-c. R.sup.5 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer(B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).

A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.