The invention relates to an anti-fatigue cold mixed epoxy resin material, preparation method and application thereof, comprising component A and component B with mass ratio of 1:1-10:1, component A comprising fluid epoxy resin, active toughener, active diluents, coupling agent and defoamer; component B is any one of or a mixture of two or more than two of alicyclic amine or amino terminated polyether, cyanoethylamine, phenolic modified amine or hydroxyalkyl modified amine. Introduced epoxy terminated organosilicon block polyurethane prepolymer breaks the limitation that elongation at fracture of epoxy resin system based on “sea-island structure” is difficult to break through 100%. The invention is suitable for bridge deck pavement of long-span cable bearing bridge, waterproof bonding material or used for airport pavement, municipal viaduct, ramp and other occasions with high requirements for fatigue resistance of pavement material.

An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I): ##STR00001##
wherein X is selected from a single bond and a linkage group.

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

A laminate comprising a plastic substrate (A); a hardened organic polymer layer (B) provided on a surface of the plastic substrate (A) and having a storage elastic modulus of from 0.01 to 5 GPa and tan δ of from 0.1 to 2.0 at 25° C. which are measured at a temperature elevating rate of 2° C./min by a dynamic viscoelasticity test stipulated in JIS K 7244; an organic/inorganic composite layer (C) provided on a surface of the hardened organic polymer layer (B) and containing covalently bound organic polymer and metal oxide nanoparticles; and an inorganic layer (D) provided on a surface of the organic/inorganic composite layer (C) and comprising secondary particles of ceramic or metal.

A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200 C. is expressed as 1 [K.sup.1], at least one of requirements 1/210 and (12).sup.210.sup.80.4 is satisfied, where a reference value 2 is 35010.sup.6 [K.sup.1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09Ia/Ib3.0 and 0.04Ic/Ib1.0 are satisfied.

An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.